The present disclosure is generally directed to solvent mixtures for swelling and bonding polymeric substances for use in facilitating the connection of polymeric substances to other parts. A swelling solvent solution according to the present disclosure may comprise between 5% and 95% by volume n-Octane and between 5% and 95% by volume of either a heptane isomer (such as n-Heptane) or a nonane isomer (such as n-Nonane). The swelling solvent solution may be used to swell polymeric parts to enable the parts to be attached to other parts. A bonding solvent solution according to the present disclosure may comprise between 2% and 98% by volume of at least one of: acetone, MEK, heptane, octane, nonane, isohexane, and THF, and between 2% and 98% by volume cyclohexanone. The bonding solvent solution may be used to bond polymeric parts to other parts.

The present disclosure is generally directed to solvent mixtures for swelling and bonding polymeric substances for use in facilitating the connection of polymeric substances to other parts. A swelling solvent solution according to the present disclosure may comprise between 5% and 95% by volume n-Octane and between 5% and 95% by volume of either a heptane isomer (such as n-Heptane) or a nonane isomer (such as n-Nonane). The swelling solvent solution may be used to swell polymeric parts to enable the parts to be attached to other parts. A bonding solvent solution according to the present disclosure may comprise between 2% and 98% by volume of at least one of: acetone, MEK, heptane, octane, nonane, isohexane, and THF, and between 2% and 98% by volume cyclohexanone. The bonding solvent solution may be used to bond polymeric parts to other parts.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

A microstructured surface is disclosed capable of immobilizing or resisting displacement forces with respect to a target surface. The microstructured surface is capable of generating capillary bridges with a target surface. The capillary bridges can be further stabilized to generate a novel liquid enhanced adhesion mechanism.

A microstructured surface is disclosed capable of immobilizing or resisting displacement forces with respect to a target surface. The microstructured surface is capable of generating capillary bridges with a target surface. The capillary bridges can be further stabilized to generate a novel liquid enhanced adhesion mechanism.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

The present invention relates to a touch screen that is assembled by a bonding process. The touch screen includes a display module including a frame and a displaying area; a touch panel configured above the display module and to receive a touch input; and a gel-based optical adhesive partially pre-cured prior to an implementation of the bonding process, interposed between and bonding the display module and the touch panel, and having a coverage larger than the displaying area and less than an outer edge of the frame and a ratio of transmittance larger than a percent of 91%.

The present invention relates to a touch screen that is assembled by a bonding process. The touch screen includes a display module including a frame and a displaying area; a touch panel configured above the display module and to receive a touch input; and a gel-based optical adhesive partially pre-cured prior to an implementation of the bonding process, interposed between and bonding the display module and the touch panel, and having a coverage larger than the displaying area and less than an outer edge of the frame and a ratio of transmittance larger than a percent of 91%.

The present disclosure provides a display screen and a display device. The display screen includes a display panel, a cover plate, and a shielding layer disposed between the two. The display screen further includes a bonding layer disposed between the shielding layer and the display panel. The bonding layer includes a glue layer including a first side close to the display panel and a second side away from the display panel; and a light guiding portion including a light incident side configured to input ultraviolet light and a light-emitting side configured to output the ultraviolet light to the first side or the second side.