The disclosure discloses an adhesive tape cartridge including an adhesive tape roll. The adhesive tape roll winds an adhesive tape around a predetermined axis in a housing. The adhesive tape includes a base layer, a first particle-containing adhesive layer, and a first particle-free adhesive layer. The first particle-containing adhesive layer is disposed on first side of the base layer in a thickness direction and comprises an adhesive to which particles are added. The first particle-free adhesive layer is disposed in contact with the first side of the particle-containing adhesive layer in the thickness direction and comprises an adhesive to which no glittering pigment is added.

The disclosure discloses an adhesive tape cartridge including an adhesive tape roll. The adhesive tape roll winds an adhesive tape around a predetermined axis in a housing. The adhesive tape includes a base layer, a first particle-containing adhesive layer, and a first particle-free adhesive layer. The first particle-containing adhesive layer is disposed on first side of the base layer in a thickness direction and comprises an adhesive to which particles are added. The first particle-free adhesive layer is disposed in contact with the first side of the particle-containing adhesive layer in the thickness direction and comprises an adhesive to which no glittering pigment is added.

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.

A latex composition shows storage stability and spray coating characteristics and gives a soft adhesive layer after drying and a one-pack type aqueous adhesive. The latex composition includes a chloroprene-based polymer latex (A) containing a chloroprene-based polymer in an amount of 50 to 85 mass % as solid matter and an acrylic polymer latex (B) having a glass transition temperature of 52 to 9 C. and containing an acrylic polymer containing a sodium alkylbenzenesulfonate having a structure represented by the Chemical Formula (1) or a sodium alkyl diphenyl ether disulfonate in an amount of 15 to 50 mass % as solid matter, in a total amount of 100 parts by mass, and additionally at least one pH regulator (C) selected from boric acid, ammonium sulfate, and amino acids having an isoelectric point of 5.5 to 6.5 in an amount of 3 to 13 parts by mass as solid matter.

A latex composition shows storage stability and spray coating characteristics and gives a soft adhesive layer after drying and a one-pack type aqueous adhesive. The latex composition includes a chloroprene-based polymer latex (A) containing a chloroprene-based polymer in an amount of 50 to 85 mass % as solid matter and an acrylic polymer latex (B) having a glass transition temperature of 52 to 9 C. and containing an acrylic polymer containing a sodium alkylbenzenesulfonate having a structure represented by the Chemical Formula (1) or a sodium alkyl diphenyl ether disulfonate in an amount of 15 to 50 mass % as solid matter, in a total amount of 100 parts by mass, and additionally at least one pH regulator (C) selected from boric acid, ammonium sulfate, and amino acids having an isoelectric point of 5.5 to 6.5 in an amount of 3 to 13 parts by mass as solid matter.

An anisotropic conductive film having a multilayer structure having conductive particles arranged in a single layer has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermally or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a side of the second connection layer, the conductive particles for anisotropic conductive connection are arranged in a single layer, and the first connection layer contains an insulating filler.

An anisotropic conductive film having a multilayer structure having conductive particles arranged in a single layer has a first connection layer and a second connection layer formed on a surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermally or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a side of the second connection layer, the conductive particles for anisotropic conductive connection are arranged in a single layer, and the first connection layer contains an insulating filler.

An electro-optic display includes a layer of electro-optic material, at least one conductor, and an adhesive material between the layer of electro-optic material and the at least one conductor. At least one of the electro-optic material and adhesive material comprises a composite material that includes a polymer phase and a filler phase, the filler phase having a conductivity greater than or equal to 0.510.sup.3 S/m, a ratio of the coefficient of thermal expansion of the filler to the polymer is less than or equal to 0.5, and a concentration of the filler phase in the composite material is greater than or equal to a filler concentration corresponding to a conductivity transition point of the composite material.