The disclosed latex system comprises a one-component, closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed mastic sealant can also be formulated to be smoke-resistant and flame-resistant.

An adhesive includes a polymeric latex, a penetrant selected from the group consisting of: terpenes, polylimonene, limonene, carvone, a-pinene, citral, dipentene, 1,8-cineole, eucalyptol, citronellol, geraniol, citronellene, terpinen-4-ol, borneol, camphor, guayule resin, and combinations thereof; and a reinforcing filler. The adhesive has a solids content of 35-65% and a pH of 9 to 12. Articles of manufacture, such as tires and air springs incorporate the adhesive to join rubber interfaces. A method of making the adhesive is also is provided.

An adhesive includes a polymeric latex, a penetrant selected from the group consisting of: terpenes, polylimonene, limonene, carvone, a-pinene, citral, dipentene, 1,8-cineole, eucalyptol, citronellol, geraniol, citronellene, terpinen-4-ol, borneol, camphor, guayule resin, and combinations thereof; and a reinforcing filler. The adhesive has a solids content of 35-65% and a pH of 9 to 12. Articles of manufacture, such as tires and air springs incorporate the adhesive to join rubber interfaces. A method of making the adhesive is also is provided.

An adhesive includes a polymeric latex, a penetrant selected from the group consisting of: terpenes, polylimonene, limonene, carvone, a-pinene, citral, dipentene, 1,8-cineole, eucalyptol, citronellol, geraniol, citronellene, terpinen-4-ol, borneol, camphor, guayule resin, and combinations thereof; and a reinforcing filler. The adhesive has a solids content of 35-65% and a pH of 9 to 12. Articles of manufacture, such as tires and air springs incorporate the adhesive to join rubber interfaces. A method of making the adhesive is also is provided.

An adhesive delamination layer including at least one non-linear organopolysiloxane and methods for display device substrate processing are disclosed. The method includes securing the display device substrate to a carrier substrate with an adhesive delamination layer including a cured product of curing a precursor adhesive composition. The precursor adhesive composition includes Component (A), a hydrogenorganopolysiloxane and Component (B), a (C.sub.2-C.sub.20)alkenyl-functionalized organopolysiloxane, wherein the (C.sub.2-C.sub.20)alkenyl group is uninterrupted or interrupted by 1, 2, or 3 groups independently chosen from O, S, substituted or unsubstituted NH, (O(C.sub.2-C.sub.3)alkylene).sub.n- wherein n is 1 to 1,000, Si((C.sub.1-C.sub.5)alkoxy).sub.2-, and Si((C.sub.1-C.sub.5)alkyl).sub.2- wherein at least one of Component (A) and Component (B) is non-linear.

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.

A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm.sup.2 or more and 15000 N/mm.sup.2 or less, and the average particle diameter of the spacer being 10 m or more and 200 m or less.

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm.sup.2 or more and 15000 N/mm.sup.2 or less, and the average particle diameter of the spacer being 10 m or more and 200 m or less.