Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.

Embodiments of the invention include articles incorporating fibrous fragments of mats of silica fibers and methods for producing such articles. The fiber mats may be formed via electrospinning of a sol gel produced with a silicon alkoxide reagent, such as tetraethyl ortho silicate, alcohol solvent, and an acid catalyst.

The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.

The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.

The present invention is directed to a driver assist system for a vehicle including a housing which supports a device for sensing the surroundings of the vehicle. An adhesive connects the driver assist system to the vehicle. At least one of the housing and the adhesive connecting the driver assist system to the vehicle having radiant energy reflecting elements.

The present invention is directed to a driver assist system for a vehicle including a housing which supports a device for sensing the surroundings of the vehicle. An adhesive connects the driver assist system to the vehicle. At least one of the housing and the adhesive connecting the driver assist system to the vehicle having radiant energy reflecting elements.

The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

A silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl group, at least one silicon-bonded hydrogen atom, and free of an alkenyl group, or a mixture of components (B-1) and (B-2) an organosiloxane having in a molecule at least one aryl group and at least one alkenyl group; (C) an acrylic compound or a methacrylic compound; (D) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule and free of an aryl group and an alkenyl group; and (E) a hydrosilylation reaction catalyst. The silicone rubber composition exhibits excellent adhesive properties with respect to diverse organic resins it comes into contact with during its cure, and at the same time possesses excellent mold-release properties with respect to metal dies used for its molding.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.