The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.

The present invention relates to adhesion promoting composition comprising: (a) an organotitanate adhesion promoter; and (b) at least one surface active agent; and (c) optionally comprises at least one solvent; wherein the surface active agent comprises a compound selected from the group comprising a surfactant and a polymeric surfactant; wherein the adhesion promoting composition imparts adhesion on a polymer film even if: (i) quality of the film substrate has degraded, (ii) the film substrate has inconsistent surface treatments across the films. In second aspect, the present invention relates to ink compositions comprising the adhesion promoting composition. In third aspect, the present invention relates to a method for improving the adhesion of an ink composition to a substrate, wherein the ink composition comprises adhesion promoting composition. In fourth aspect, the present invention relates to a substrate having improved adhesion of an ink composition, wherein the ink composition comprises adhesion promoting composition.

The present invention relates to adhesion promoting composition comprising: (a) an organotitanate adhesion promoter; and (b) at least one surface active agent; and (c) optionally comprises at least one solvent; wherein the surface active agent comprises a compound selected from the group comprising a surfactant and a polymeric surfactant; wherein the adhesion promoting composition imparts adhesion on a polymer film even if: (i) quality of the film substrate has degraded, (ii) the film substrate has inconsistent surface treatments across the films. In second aspect, the present invention relates to ink compositions comprising the adhesion promoting composition. In third aspect, the present invention relates to a method for improving the adhesion of an ink composition to a substrate, wherein the ink composition comprises adhesion promoting composition. In fourth aspect, the present invention relates to a substrate having improved adhesion of an ink composition, wherein the ink composition comprises adhesion promoting composition.

A pressure sensitive adhesive composition includes a polyurethane polymer that includes the reaction product of a polyisocyanate component and a polyol component. The polyol component has a total solubility parameter ranging from 10 to 14 (cal/cm.sup.3).sup.1/2.

A pressure sensitive adhesive composition includes a polyurethane polymer that includes the reaction product of a polyisocyanate component and a polyol component. The polyol component has a total solubility parameter ranging from 10 to 14 (cal/cm.sup.3).sup.1/2.

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Provided is an adhesive for use in an ultraviolet-light-emitting device using ultraviolet light having a wavelength of from 200 to 400 nm as a light source, which can attach adherends made of a polymer having a fluorine-containing alicyclic structure with excellent adhesiveness which is unlikely to be impaired by exposure to such ultraviolet light or heat. An adhesive for forming an adhesive joint in an ultraviolet-light-emitting device, which is either the following adhesive (A) or the following adhesive (B) comprising a fluoropolymer having a fluorine-containing alicyclic structure: the adhesive (A): an adhesive in which the glass transition temperature of the fluoropolymer is from 30 to 100 C., and which does not contain an ultraviolet-shielding agent; and the adhesive (B): an adhesive comprising the fluoropolymer and an ultraviolet-shielding agent.

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm.sup.2 or more and 15000 N/mm.sup.2 or less, and the average particle diameter of the spacer being 10 m or more and 200 m or less.

Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.

Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.