Patent classifications
C09J11/00
Adhesive Containing Microparticles
Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.
Adhesive containing microparticles
Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.
Adhesive containing microparticles
Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.
Electrically conductive particle and manufacturing method thereof, and electrically conductive adhesive and manufacturing method thereof
Embodiments of the present disclosure relate to an electrically conductive particle and a manufacturing method thereof as well as an electrically conductive adhesive comprising the electrically conductive particle and a manufacturing method thereof. The electrically conductive particle comprises: a core microsphere; an electrically conductive macromolecular layer encapsulating the core microsphere; and a 3D graphene layer and a metal layer encapsulating the electrically conductive macromolecular layer.
System and method for flexible sealant with density modifier
The disclosed latex system comprises a one-component, closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed mastic sealant can also be formulated to be smoke-resistant and flame-resistant.
System and method for flexible sealant with density modifier
The disclosed latex system comprises a one-component, closed-cell, semi-foam, mastic sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed mastic sealant can also be formulated to be smoke-resistant and flame-resistant.
Adhesive tape cartridge, adhesive tape roll, and method of manufacturing an adhesive tape roll
The disclosure discloses an adhesive tape cartridge including an adhesive tape roll. The adhesive tape roll winds an adhesive tape around a predetermined axis in a housing. The adhesive tape includes a base layer, and a first particle-containing adhesive layer. The first particle-containing adhesive layer is disposed on first side of the base layer in a thickness direction and comprises an adhesive to which particles having an average particle diameter of 10 μm or more are added. On condition that the first particle-containing adhesive layer is virtually divided into two equal parts as a first region on the first side in the thickness direction and an second region on an second side in the thickness direction, a volume proportion of the particles to the adhesive in the second region is larger than a volume proportion of the particles to the adhesive in the first region.
Adhesive tape cartridge, adhesive tape roll, and method of manufacturing an adhesive tape roll
The disclosure discloses an adhesive tape cartridge including an adhesive tape roll. The adhesive tape roll winds an adhesive tape around a predetermined axis in a housing. The adhesive tape includes a base layer, and a first particle-containing adhesive layer. The first particle-containing adhesive layer is disposed on first side of the base layer in a thickness direction and comprises an adhesive to which particles having an average particle diameter of 10 μm or more are added. On condition that the first particle-containing adhesive layer is virtually divided into two equal parts as a first region on the first side in the thickness direction and an second region on an second side in the thickness direction, a volume proportion of the particles to the adhesive in the second region is larger than a volume proportion of the particles to the adhesive in the first region.
Curable resin composition
A liquid thermally expandable curable resin composition for use such as bonding by filling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100° C. or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-1)/(C-2)=0.12 to 0.23.
Curable resin composition
A liquid thermally expandable curable resin composition for use such as bonding by filling a clearance has difficulty in achieving both drying property and film forming property and also has a problem with storage stability. The problems were solved with a curable resin composition having the following composition. A curable resin composition comprises: (A) a film forming resin, (B) an epoxy resin, (C) an organic solvent, (D) thermally expandable particles, and (E) a curing agent ingredient for the (B). The (C) is selected from organic solvents having a boiling point of 100° C. or less and being liquid at normal temperature and contains a combination of (C-1) an ester-based solvent and (C-2) one or more solvents selected from ketone-based solvents, ether-based solvents, and glycol-based solvents, and a content ratio between the (C-1) and the (C-2) in a mass ratio is in a range of (C-1)/(C-2)=0.12 to 0.23.