Patent classifications
C09J109/00
RESIN COMPOSITION AND DISPLAY UNIT
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.
RESIN COMPOSITION AND DISPLAY UNIT
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
ADHESIVE TREATMENT FOR FIBER FOR POLYMER REINFORCEMENT AND REINFORCED PRODUCTS
An aqueous adhesive composition for treating a reinforcing fiber for bonding to a thermosetting polymer matrix and products made therefrom such as power transmission belts. The adhesive composition includes: water as the solvent or dispersing medium; a polyelectrolyte co-curable with the polymer matrix; a primer material compatible with the fiber and co-curable with the polyelectrolyte; and optionally a rubber curative compatible with the polyelectrolyte and the polymer matrix. A fiber-reinforced, composite polymer system may thus include a thermosetting polymer matrix, a reinforcing fiber embedded therein, and an adhesive composition coating the fiber; the adhesive composition including a polyelectrolyte co-curable with the polymer matrix and a primer material compatible with the fiber and co-curable with the polyelectrolyte. The adhesive composition may include a curative compatible with the polyelectrolyte. In one preferred embodiment, the invention is an aqueous adhesive composition including water, an epoxy resin, a maleated polybutadiene derivative, and a curative.
ADHESIVE TREATMENT FOR FIBER FOR POLYMER REINFORCEMENT AND REINFORCED PRODUCTS
An aqueous adhesive composition for treating a reinforcing fiber for bonding to a thermosetting polymer matrix and products made therefrom such as power transmission belts. The adhesive composition includes: water as the solvent or dispersing medium; a polyelectrolyte co-curable with the polymer matrix; a primer material compatible with the fiber and co-curable with the polyelectrolyte; and optionally a rubber curative compatible with the polyelectrolyte and the polymer matrix. A fiber-reinforced, composite polymer system may thus include a thermosetting polymer matrix, a reinforcing fiber embedded therein, and an adhesive composition coating the fiber; the adhesive composition including a polyelectrolyte co-curable with the polymer matrix and a primer material compatible with the fiber and co-curable with the polyelectrolyte. The adhesive composition may include a curative compatible with the polyelectrolyte. In one preferred embodiment, the invention is an aqueous adhesive composition including water, an epoxy resin, a maleated polybutadiene derivative, and a curative.
RESIN COMPOSITION AND DISPLAY UNIT
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.
RESIN COMPOSITION AND DISPLAY UNIT
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.
RESIN COMPOSITION AND DISPLAY UNIT
A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.
Adhesion promoting and/or dust suppression coating
An adhesion promoter coating composition includes an oligomeric alkylalkoxysiloxane and a compound comprising an electrophile moiety and an alkoxysilyl moiety. The electrophile moiety may contain a sulfide functional group, for example. A dust suppression coating composition includes an acrylic polymer comprising a quaternary ammonium moiety; and an oligomeric alkylalkoxysiloxane. The coating composition may be applied to roofing granules, and/or asphaltic compositions, among other things.