An adhesion promoter coating composition includes an oligomeric alkylalkoxysiloxane and a compound comprising an electrophile moiety and an alkoxysilyl moiety. The electrophile moiety may contain a sulfide functional group, for example. A dust suppression coating composition includes an acrylic polymer comprising a quaternary ammonium moiety; and an oligomeric alkylalkoxysiloxane. The coating composition may be applied to roofing granules, and/or asphaltic compositions, among other things.

The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.

A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.

A display unit that includes an image display part and a light-transmitting protective part arranged on the image display part. A cured resin layer is arranged between the display part and the protective part. The cured resin layer has a transmittance of 90% or higher in the visible range and a storage modulus at 25 C. of 110.sup.7 Pa or less. The cured resin layer is formed from a resin composition that has a cure shrinkage of 5% or less.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.