A hydrophobic binder/adhesive, for treating a substrate, may include about 60% to 98.9% by weight bulk polymer selected from one or more monomers associated with styrene, vinyl acetate, acrylic acid ester, methacrylic acid esters, ethylene, or butadiene; about 0.1% to about 10.0%, by weight of one or more hydrophobic monomers selected from stearyl methacrylate or laurel acrylate; and about 1% to about 30%, by weight of one or more protective colloids associated with a hard resin polymer. The hydrophobic binder/adhesive may increase resistance to wetting of the substrate when expose to moisture, and increases durability of the substrate.

A hydrophobic binder/adhesive, for treating a substrate, may include about 60% to 98.9% by weight bulk polymer selected from one or more monomers associated with styrene, vinyl acetate, acrylic acid ester, methacrylic acid esters, ethylene, or butadiene; about 0.1% to about 10.0%, by weight of one or more hydrophobic monomers selected from stearyl methacrylate or laurel acrylate; and about 1% to about 30%, by weight of one or more protective colloids associated with a hard resin polymer. The hydrophobic binder/adhesive may increase resistance to wetting of the substrate when expose to moisture, and increases durability of the substrate.

Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage S.sub.MD in its machine direction and a thermal shrinkage S.sub.TD in its transverse direction (direction perpendicular to the machine direction) of both 2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm.sup.2 or less when determined at 80 C. for 3 hours by GC/MS.

Provided is a PSA sheet for use in electronic devices suitable for their downsizing and densification. The PSA sheet for electronic devices provided by this invention comprises a substrate and a PSA layer provided to at least one face of the substrate. The PSA sheet has a laser absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm; has a thermal shrinkage S.sub.MD in its machine direction and a thermal shrinkage S.sub.TD in its transverse direction (direction perpendicular to the machine direction) of both 2 % or greater and 2% or less; and has an amount of thermally released gas of 1300 ng/cm.sup.2 or less when determined at 80 C. for 3 hours by GC/MS.

There are provided a modified liquid diene rubber that can be used for a curable resin composition and a resin composition containing the modified liquid diene rubber. The curable resin composition containing the modified liquid diene rubber has a much higher curing rate than that in the related art, and the resulting cured product has excellent mechanical properties, transparency, and heat resistance. Produced are a modified liquid diene rubber and a resin composition containing the modified liquid diene rubber. The modified liquid diene rubber includes a modifying group (p) partly containing a (meth)acryloyl group therein and a monomer unit (a1) derived from a conjugated diene compound. A carbon-carbon double bond derived from the conjugated diene compound has a hydrogenation rate of 30 to 95 mol %, and the modifying group (p) has a functional group equivalent weight of 700 to 20,000 g/eq.

There are provided a modified liquid diene rubber that can be used for a curable resin composition and a resin composition containing the modified liquid diene rubber. The curable resin composition containing the modified liquid diene rubber has a much higher curing rate than that in the related art, and the resulting cured product has excellent mechanical properties, transparency, and heat resistance. Produced are a modified liquid diene rubber and a resin composition containing the modified liquid diene rubber. The modified liquid diene rubber includes a modifying group (p) partly containing a (meth)acryloyl group therein and a monomer unit (a1) derived from a conjugated diene compound. A carbon-carbon double bond derived from the conjugated diene compound has a hydrogenation rate of 30 to 95 mol %, and the modifying group (p) has a functional group equivalent weight of 700 to 20,000 g/eq.

A method of producing a packaging structure, including the steps: coating at least one surface of a first sheet base material and/or a second sheet base material with a synthetic polyisoprene latex having a weight average molecular weight of 500,000 -5,000,000 and/or a styrene-isoprene-styrene block copolymer having a weight average molecular weight of 100,000-300,000, sandwiching an article to be packaged in a state wherein the first and second sheet base material are in contact with each other via a latex coated surface formed on the first and/or second sheet base material to thereby obtain a laminated body, pressing a portion where at least the first and second sheet base material of the laminated body are in contact with each other via the latex coated surface at a temperature of 100 C. or less to thereby obtain a pressed laminated body, and performing a sterilization treatment on the pressed laminated body.

The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.

The invention relates to a foamable hot melt adhesive composition, method of foaming the foamable hot melt adhesive composition, and method of using the foamed hot melt adhesive composition. The foamed hot melt adhesive provides a reliable adhesion with high heat resistance for packaging applications. The present invention provides an environmentally and economically sound adhesive that provides sufficient adhesion to the packages upon which it is being applied.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.