The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

The present invention was made in view of the foregoing problem and has an object to provide a photocurable resin composition which can be quickly cured by irradiation with active energy rays such as ultraviolet rays and achieves excellent adhesion to polyolefin such as PP having properties difficult to bond. Specifically, provided is a photocurable resin composition containing the following (A) and (B) ingredients: (A) ingredient: a polymer having a polyisobutylene backbone mainly containing a —[CH.sub.2C(CH.sub.3).sub.2]— unit, the polymer having one or more (meth)acryloyl groups per molecule; and (B) ingredient: a photo-radical initiator of hydrogen abstraction type.

The present invention was made in view of the foregoing problem and has an object to provide a photocurable resin composition which can be quickly cured by irradiation with active energy rays such as ultraviolet rays and achieves excellent adhesion to polyolefin such as PP having properties difficult to bond. Specifically, provided is a photocurable resin composition containing the following (A) and (B) ingredients: (A) ingredient: a polymer having a polyisobutylene backbone mainly containing a —[CH.sub.2C(CH.sub.3).sub.2]— unit, the polymer having one or more (meth)acryloyl groups per molecule; and (B) ingredient: a photo-radical initiator of hydrogen abstraction type.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

The present invention provides hot melt adhesives for disposable products. The hot melt adhesives may be applied at high-speed and at low temperature ranges. The hot melt adhesives also provide excellent adhesion to polyethylene and a nonwoven fabric. The hot melt adhesive comprises (A) a thermoplastic block copolymer, which is a copolymer of a vinyl-based aromatic hydrocarbon with a conjugated diene compound; and (B) a propylene homopolymer having a melting point of 100° C. or lower, which is obtainable by polymerizing propylene using a metallocene catalyst. The disposable products are produced at high-speeds and low temperature with the inventive hot melt, and therefore, the disposal products are produced efficiently and safely, and a nonwoven fabric and a polyethylene film of the disposable products are less likely to peel.

The present invention provides hot melt adhesives for disposable products. The hot melt adhesives may be applied at high-speed and at low temperature ranges. The hot melt adhesives also provide excellent adhesion to polyethylene and a nonwoven fabric. The hot melt adhesive comprises (A) a thermoplastic block copolymer, which is a copolymer of a vinyl-based aromatic hydrocarbon with a conjugated diene compound; and (B) a propylene homopolymer having a melting point of 100° C. or lower, which is obtainable by polymerizing propylene using a metallocene catalyst. The disposable products are produced at high-speeds and low temperature with the inventive hot melt, and therefore, the disposal products are produced efficiently and safely, and a nonwoven fabric and a polyethylene film of the disposable products are less likely to peel.

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.