The present invention provides: a modified isobutylene-isoprene rubber including a structural unit of Chemical Formula I, a production method for the same, and a cured material formed by thermally curing the same (in Chemical Formula I, X is an alkyl group including at least two carboxyl groups). The modified isobutylene-isoprene rubber exhibits excellent characteristics in terms of adhesive properties, flexibility, water vapor transmission resistance and transparency.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

The present invention relates to an optical adhesive composition including: a thermosetting component including an isoprene-based rubber containing a carboxyl group, and a thermal curing agent; and a photo-curable component including an acrylic acid ester-based monomer, and a photoinitiator, in order to exhibit high barrier performance on the basis of a low water vapor transmission rate, and simultaneously, exhibit excellent adhesive performance by being applied to an optical device or a display device. In addition, the present invention provides an optical adhesive film including an adhesive layer including a photo-cured product of the optical adhesive composition, thereby obtaining advantages of ensuring an excellent cutting property and an excellent handling property, and improving a step difference absorbency.

The present invention relates to an optical adhesive composition including: a thermosetting component including an isoprene-based rubber containing a carboxyl group, and a thermal curing agent; and a photo-curable component including an acrylic acid ester-based monomer, and a photoinitiator, in order to exhibit high barrier performance on the basis of a low water vapor transmission rate, and simultaneously, exhibit excellent adhesive performance by being applied to an optical device or a display device. In addition, the present invention provides an optical adhesive film including an adhesive layer including a photo-cured product of the optical adhesive composition, thereby obtaining advantages of ensuring an excellent cutting property and an excellent handling property, and improving a step difference absorbency.

Provided is a film adhesive which is preferably used as a NCF, void-free, has excellent electrical connectivity and its high reliability, does not develop cracks easily, and has high surface flatness. Also provided is a semiconductor device in which the film adhesive according to the present invention is used as an NCF during the manufacture of the semiconductor device. The film adhesive according to the present invention contains (A) an epoxy resin; (B) a bisphenol F type phenoxy resin; (C) a phenol resin-based curing agent; (D) a modified imidazole compound; (E) a silica filler; (F) oxyquinoline; and (G) a butadiene-acrylonitrile-methacrylic acid copolymer. The content of component (A) is 19.3 to 33.8 parts by mass. The content of component (B) is 7.5 to 9.1 parts by mass. The content of component (D) is 1.915 to 5 parts by mass. The content of component (E) is 30 to 60 parts by mass. The content of component (F) is 2.5 to 10 parts by mass. The liquid epoxy resin of component (A) contains a phenol novolac type epoxy resin and a liquid epoxy resin. The ratio of phenol novolac type epoxy resin to the epoxy resin of component (A) is not less than 46%. The equivalent ratio of component (C) relative to component (A) is 0.25 to 0.75.

A thermal interface material that conducts heat is disclosed. The thermal interface includes a bulk layer and at least one adhesive layer. The bulk layer includes a first acrylic rubber, plasticizer particles, and first filler particles, and the first filler particles are substantially aligned in a first direction. The first adhesive layer is disposed on a first side of the bulk material. The first adhesive layer has a greater tackiness than the bulk material. The first adhesive layer comprises a second acrylic rubber. The first direction is substantially perpendicular to a first surface of the first side on which the first adhesive layer is disposed.

A thermal interface material that conducts heat is disclosed. The thermal interface includes a bulk layer and at least one adhesive layer. The bulk layer includes a first acrylic rubber, plasticizer particles, and first filler particles, and the first filler particles are substantially aligned in a first direction. The first adhesive layer is disposed on a first side of the bulk material. The first adhesive layer has a greater tackiness than the bulk material. The first adhesive layer comprises a second acrylic rubber. The first direction is substantially perpendicular to a first surface of the first side on which the first adhesive layer is disposed.

The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of 160 C., preferably, from 160 C. to 260 C., more preferably from 240 C. to 250 C.

The present invention relates to a photocurable adhesive composition and the use of the same. Specifically, said photocurable adhesive composition mainly comprises, based on 100 parts by weight of the adhesive composition, component A: from 70 to 99 parts by weight of one or more polymers carrying (meth)acryloxyl group; component B: from 0 to 30 parts by weight, preferably from 0 to 25 parts by weight of one or more (meth)acrylates monomers; component C: from 0.5 to 10 parts by weight of at least one UV absorber; and component D: from 0 to 5 parts by weight of antioxidant. The present invention also relates to the use of the adhesive composition mentioned above in the production of an ITO substrate for temporarily bonding a substrate and a temporary carrier and going through a high temperature processing, for example, at a temperature of 160 C., preferably, from 160 C. to 260 C., more preferably from 240 C. to 250 C.

An aqueous adhesive composition for treating a reinforcing fiber for bonding to a thermosetting polymer matrix and products made therefrom such as power transmission belts. The adhesive composition includes: water as the solvent or dispersing medium; a polyelectrolyte co-curable with the polymer matrix; a primer material compatible with the fiber and co-curable with the polyelectrolyte; and optionally a rubber curative compatible with the polyelectrolyte and the polymer matrix. A fiber-reinforced, composite polymer system may thus include a thermosetting polymer matrix, a reinforcing fiber embedded therein, and an adhesive composition coating the fiber; the adhesive composition including a polyelectrolyte co-curable with the polymer matrix and a primer material compatible with the fiber and co-curable with the polyelectrolyte. The adhesive composition may include a curative compatible with the polyelectrolyte. In one preferred embodiment, the invention is an aqueous adhesive composition including water, an epoxy resin, a maleated polybutadiene derivative, and a curative.