Patent classifications
C09J115/00
Curable compositions comprising polyol component, functional butadiene component, and thermally conductive filler, articles therefrom, and methods of making and using same
A curable composition includes a polyol component comprising one or more polyols: a functional butadiene component; and a thermally conductive filler. The thermally conductive filler is present in an amount of at least 20 wt. %, based on the total weight of the curable composition. The curable composition has, upon curing, a thermal conductivity of at least 0.5 W/(mK).
Curable compositions comprising polyol component, functional butadiene component, and thermally conductive filler, articles therefrom, and methods of making and using same
A curable composition includes a polyol component comprising one or more polyols: a functional butadiene component; and a thermally conductive filler. The thermally conductive filler is present in an amount of at least 20 wt. %, based on the total weight of the curable composition. The curable composition has, upon curing, a thermal conductivity of at least 0.5 W/(mK).
Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and moisture-permeable waterproof pressure-sensitive adhesive sheet
A pressure-sensitive adhesive composition includes 100 parts by mass of a rubber component containing 40 to 93 mass % of a butyl rubber and 7 to 60 mass % of a polyisobutylene and 82 to 128 parts by mass of a softener having a kinetic viscosity at 40 C. of 100 to 9,000 mm.sup.2/s.
Method for creating an adhesive bond using an elastomeric material
Embodiments herein provides a system for creating an adhesive bond using elastomeric material. The system includes the steps of (i) a first material, the first material having a first material length and a first material width, (ii) a second material, the second material having a second material length and a second material width, (iii) a gap between the first material and the second material, (iv) an elastomeric material substantially filling at least a portion of the height and length of the gap between the first material and the second material. The gap includes a height and a length. The height being substantially equal to a distance between the first material and the second material and the length being substantially orthogonal to the height and defined by a degree of overlap between the first and second materials.
Method for creating an adhesive bond using an elastomeric material
Embodiments herein provides a system for creating an adhesive bond using elastomeric material. The system includes the steps of (i) a first material, the first material having a first material length and a first material width, (ii) a second material, the second material having a second material length and a second material width, (iii) a gap between the first material and the second material, (iv) an elastomeric material substantially filling at least a portion of the height and length of the gap between the first material and the second material. The gap includes a height and a length. The height being substantially equal to a distance between the first material and the second material and the length being substantially orthogonal to the height and defined by a degree of overlap between the first and second materials.
FARNESENE-BASED TACKIFYING RESINS AND ADHESIVE COMPOSITIONS CONTAINING THE SAME
A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition.
Method for covering elongated articles, in particular lines
The invention relates to a method for covering elongated articles, in particular cable sets using a curable adhesive tape.
POSITIVE ELECTRODE, PREPARATION METHOD THEREOF, AND RECHARGEABLE LITHIUM BATTERIES
Disclosed are a positive electrode, a preparation method thereof, and a rechargeable lithium battery including the same, the positive electrode including a positive electrode current collector; and a positive electrode active material layer located on the positive electrode current collector and including a positive electrode active material, a binder, and a conductive material; wherein the binder includes a first binder and a second binder, the first binder is a hydrogenated nitrile butadiene rubber, the second binder includes an imide-based binder, and the positive electrode active material layer includes about 300 to about 1,300 parts by weight of the second binder based on 100 parts by weight of the first binder.
Method for jacketing elongate articles, in particular lines
The invention relates to a method for jacketing elongate articles, such as lines or cable harnesses in particular, by means of an adhesive tape comprising a tape-shaped substrate, which substrate has, on at least one side, a thermally curable, meltable, preferably pressure-sensitive adhesive layer, the adhesive layer comprising an epoxide-functionalized acrylonitrile-butadiene copolymer which has on average more than 1.5 epoxide groups per molecule and comprising the reaction product of phthalic anhydride and diethylene-triamine, the adhesive tape being led in a helix around the elongate article or the elongate article being enveloped by the adhesive tape in the axial direction, the elongate article together with the enveloping adhesive tape being brought into the desired arrangement, in particular into the cable harness plan, the elongate article being held in this arrangement, and the curable adhesive mass being cured by supplying thermal energy, in particular at a temperature of up to 110 C.