Pull-on disposable absorbent articles with elastomeric belts are provided. The elastomeric belts include an outer nonwoven, an inner nonwoven, and elastic strands disposed therebetween. The elastomeric belts further have a front belt portion having a front waist edge, and front left and right side edges, and a rear belt portion having a rear waist edge and rear left and right side edges. An adhesive bonds at least one of the group consisting of the belt structure to the central chassis; the belt structure outer nonwoven to the belt structure inner nonwoven; the elastic strands to the belt structure nonwovens; and the respective front and rear left side edges and the front and rear right side edges. The adhesive is substantially tackifier-free.

Pull-on disposable absorbent articles with elastomeric belts are provided. The elastomeric belts include an outer nonwoven, an inner nonwoven, and elastic strands disposed therebetween. The elastomeric belts further have a front belt portion having a front waist edge, and front left and right side edges, and a rear belt portion having a rear waist edge and rear left and right side edges. An adhesive bonds at least one of the group consisting of the belt structure to the central chassis; the belt structure outer nonwoven to the belt structure inner nonwoven; the elastic strands to the belt structure nonwovens; and the respective front and rear left side edges and the front and rear right side edges. The adhesive is substantially tackifier-free.

A rubber member for laser bonding of the present invention containing a rubber ingredient and silica, wherein the silica has an average particle size of more than 50 nm and 120 nm or less, and the amount of the silica is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient, the rubber member has a laser light transmittance of 30% or more, provided that the laser light transmittance is a transmittance when the rubber member has a thickness of 2 mm and is irradiated with laser light having a wavelength of 808 nm. The silica preferably includes silica having an average particle size of more than 50 nm and 120 nm or less and silica having an average particle size of 5 nm to 50 nm, and the amount of the silica having an average particle size of more than 50 nm and 120 nm or less is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient and the amount of the silica having an average particle size of 5 nm to 50 nm is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient.

A rubber member for laser bonding of the present invention containing a rubber ingredient and silica, wherein the silica has an average particle size of more than 50 nm and 120 nm or less, and the amount of the silica is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient, the rubber member has a laser light transmittance of 30% or more, provided that the laser light transmittance is a transmittance when the rubber member has a thickness of 2 mm and is irradiated with laser light having a wavelength of 808 nm. The silica preferably includes silica having an average particle size of more than 50 nm and 120 nm or less and silica having an average particle size of 5 nm to 50 nm, and the amount of the silica having an average particle size of more than 50 nm and 120 nm or less is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient and the amount of the silica having an average particle size of 5 nm to 50 nm is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient.

The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

The present invention relates to a rubber-based adhesive composition and a rubber-based adhesive using the same, the composition including: a rubber-based resin; and a rosin-based resin having at least one hydrophilic group.

The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 m, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.