A pressure sensitive adhesive sheet may include a base material and a hot-melt pressure sensitive adhesive layer which contains a softener, and further include a barrier layer disposed between the base material and the hot-melt pressure sensitive adhesive layer, the barrier layer containing at least one selected from the group consisting of a polyester-based resin, a polyurethane-based resin, and a polyolefin-based resin. The polyester-based resin may be at least one of a polyester resin or a modified polyester resin.

A pressure sensitive adhesive sheet may include a base material and a hot-melt pressure sensitive adhesive layer which contains a softener, and further include a barrier layer disposed between the base material and the hot-melt pressure sensitive adhesive layer, the barrier layer containing at least one selected from the group consisting of a polyester-based resin, a polyurethane-based resin, and a polyolefin-based resin. The polyester-based resin may be at least one of a polyester resin or a modified polyester resin.

Process for producing a pressure-sensitive adhesive comprising expanded microballoons, wherein the constituents for forming the adhesive are mixed in a first mixing assembly, the mixed adhesive is transferred into a second mixing assembly into which, at the same time, unexpanded microballoons are fed, the microballoons are expanded in the second mixing assembly or on exit from the second mixing assembly, the adhesive mixture with the expanded microballoons is shaped to a layer in a shaping assembly in which expanded microballoons which have broken through the surface are pressed into the layer surface and the layer of adhesive mixture together with the expanded microballoons are optionally applied to a weblike backing material.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition.

The present invention provides an adhesive resin composition that is used for adhesion of a fluorine-based resin and is aimed at adhesion between fluorine-based resins or between a fluorine-based resin and a material other than a fluorine-based resin. More specifically, the present invention relates to an adhesive resin composition for use in adhesion of a fluorine-based resin, the composition including a polyethylene-based resin, an elastomer component, and a component having an epoxy group and a vinyl group, wherein a content of the polyethylene-based resin is 55 parts by mass or more and 90 parts by mass or less, a content of the elastomer component is 10 parts by mass or more and 45 parts by mass or less, the elastomer component and the component having an epoxy group and a vinyl group have a common repetition unit, and a content of the component having an epoxy group and a vinyl group based on a total amount of 100 parts by mass of the polyethylene-based resin and the elastomer component is 0.1 parts by mass or more and 1.5 parts by mass or less.

Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375 C. or higher when heated at an elevation rate of 20 C./min from 25 C., a solvent represented by the following General Formula (1) and having a boiling point of 160 C. or higher, and a solvent having a boiling point of lower than 120 C. In General Formula (1), R.sup.1 to R.sup.6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group. ##STR00001##

Provided are a composition which has good elastomer solubility, is thus capable of increasing a concentration of solid contents, and is capable of forming a film having excellent drying properties, surface morphology, and heat resistance, a process for producing a sheet, a sheet, a laminate, and a laminate with a device wafer. This composition includes an elastomer having a 5% thermal mass reduction temperature of 375 C. or higher when heated at an elevation rate of 20 C./min from 25 C., a solvent represented by the following General Formula (1) and having a boiling point of 160 C. or higher, and a solvent having a boiling point of lower than 120 C. In General Formula (1), R.sup.1 to R.sup.6 each independently represent a hydrogen atom or an aliphatic hydrocarbon group. ##STR00001##

An adhesive used in underground applications where vegetation is present wherein the adhesive has been doped with a material or materials that deter the growth properties of adjacent vegetation. The materials can include Zinc, Copper Sulfate, Copper Oxide, as well as sulfates of Zinc, Manganese, and Nickel, in quantities that will repel or deter the advancement of roots and invasive vegetation into fittings and joints in an underground system. The adhesive is used to bond a conduit and a fitting in an air-tight and water tight seal, and the inclusion of the root deterrent material resists invasion of nearby roots into the piping. The root deterring supplements to the adhesive to not degrade the performance of the adhesive and actually repel roots in the vicinity of the materials.

An adhesive used in underground applications where vegetation is present wherein the adhesive has been doped with a material or materials that deter the growth properties of adjacent vegetation. The materials can include Zinc, Copper Sulfate, Copper Oxide, as well as sulfates of Zinc, Manganese, and Nickel, in quantities that will repel or deter the advancement of roots and invasive vegetation into fittings and joints in an underground system. The adhesive is used to bond a conduit and a fitting in an air-tight and water tight seal, and the inclusion of the root deterrent material resists invasion of nearby roots into the piping. The root deterring supplements to the adhesive to not degrade the performance of the adhesive and actually repel roots in the vicinity of the materials.

The present invention relates to an adhesive composition containing a base polymer and a moisture-curable component, wherein the base polymer contains a polymer having no functional group which reacts with the moisture-curable component, and a water content of the base polymer after storage at 25 C. and 50% RH for 24 hours is 0.1% by weight or less, and wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.