Two-component adhesion composition suitable for extrusion coating paper substrates which comprises: a) from 70 to 98 wt % of high melt strength polypropylene (A) with a branching index g of 0.9 or less; and b) from 2 to 30 wt % of a component (B) selected from the group consisting of: (i) maleic anhydride-modified polypropylene (MAPP); (ii) maleic anhydride-modified polypropylene wax; (iii) polypropylene homopolymer with high melt flow rate; or (iv) ethylene-vinyl acetate-based hot melt adhesive,
and its use.

According to the present invention, a thermally conductive grease composition contains a base oil, a thermally conductive filler, an acrylic polymer-based adhesive, and a surface modifier.

According to the present invention, a thermally conductive grease composition contains a base oil, a thermally conductive filler, an acrylic polymer-based adhesive, and a surface modifier.

The present invention relates to a system for the production of a sealant composite made of a primary sealing material and a curable secondary sealing material, the use of the system for the production of insulating glass or solar modules, an edge seal for the production of double-pane or multi-pane insulating glass or solar modules comprising the sealant composite and an insulating glass unit comprising at least two glass panes and the edge seal.

The present invention relates to a system for the production of a sealant composite made of a primary sealing material and a curable secondary sealing material, the use of the system for the production of insulating glass or solar modules, an edge seal for the production of double-pane or multi-pane insulating glass or solar modules comprising the sealant composite and an insulating glass unit comprising at least two glass panes and the edge seal.

A biodegradable hot melt adhesive composition including from 7.5% by weight to 95% by weight of an olefin polymer, from 0.15% by weight to 0.8% by weight of an antioxidant, from 0.005% by weight to 0.4% by weight of a saturated, or mono- or poly-unsaturated C 14-C 24 linear carboxylic acid, or an ester, anhydride or amide thereof, and from 0.02% by weight to 1.0% by weight of a transition metal compound, wherein the transition metal is selected from the group consisting of iron, manganese, copper, cobalt and cerium.

A biodegradable hot melt adhesive composition including from 7.5% by weight to 95% by weight of an olefin polymer, from 0.15% by weight to 0.8% by weight of an antioxidant, from 0.005% by weight to 0.4% by weight of a saturated, or mono- or poly-unsaturated C 14-C 24 linear carboxylic acid, or an ester, anhydride or amide thereof, and from 0.02% by weight to 1.0% by weight of a transition metal compound, wherein the transition metal is selected from the group consisting of iron, manganese, copper, cobalt and cerium.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tan/r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tan denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz and r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tan/r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tan denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz and r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.

A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tan/r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tan denotes a dielectric dissipation factor at 23 degrees C. and a frequency of 40.68 MHz and r denotes a relative permittivity at 23 degrees C. and the frequency of 40.68 MHz.