The disclosure relates to a hydrogenated styrenic block copolymer with high vinyl content, low viscosity, low order-disorder temperature and improved processability. The hydrogenated styrenic block copolymers can be extruded or molded with a minimum of additives. The hydrogenated styrenic block copolymers have high melt flows allowing for ease in processing such as injection molding, overmolding, dipping, extrusion, roto-molding, slush molding, fiber spinning, film making, 3D printing and foaming.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.

The present invention relates to a hot melt adhesive composition comprising at least one particular aldehyde scavenger, and the use of said aldehyde scavenger(s) to remove or reduce the volatile organic compound(s) (VOC), particularly volatile aldehyde(s) of a hot melt adhesive composition. The hot melt adhesive compositions according to the invention emit low odor during and after their manufacture and application, and are thus particularly useful to manufacture low odor disposable nonwoven absorbent articles.

The present invention relates to a hot melt adhesive composition comprising at least one particular aldehyde scavenger, and the use of said aldehyde scavenger(s) to remove or reduce the volatile organic compound(s) (VOC), particularly volatile aldehyde(s) of a hot melt adhesive composition. The hot melt adhesive compositions according to the invention emit low odor during and after their manufacture and application, and are thus particularly useful to manufacture low odor disposable nonwoven absorbent articles.

An aqueous resin dispersion with which excellent adhesiveness to a polyolefin base material such as a polypropylene base material can be easily obtained, which can be baked at low temperature, and which is for producing an aqueous coating material; and an aqueous coating material and an adhesive which contain the aqueous resin dispersion, are provided. In an aqueous resin dispersion (C) of the present invention, an olefin polymer (A) and a polymer (B) containing a constitutional unit derived from a radically polymerizable monomer (b1) having a reactive functional group are dispersed in an aqueous medium, a median diameter of the aqueous resin dispersion (C) measured by a dynamic light scattering method is 300 nm or less, and a dry product of the aqueous resin dispersion (C) contains 1 mass % or more of an insoluble component (D) that is insoluble in tetrahydrofuran.

A disposable absorbent article for wearing about the lower torso of a wearer is provided. The disposable absorbent article has a chassis including: a topsheet; a backsheet containing a polymeric film; and an absorbent core disposed between the topsheet and the backsheet. The polymeric film is at least 20 mm more narrow than the chassis. The disposable absorbent article has an opacity strengthening patch disposed on the backsheet, wherein the opacity strengthening patch is connected to one of the group consisting of the leg gasketing system, the polymeric film layer, and the backsheet by an adhesive. The adhesive includes: an amorphous polyolefin composition and a heterophase polyolefin composition having an amorphous character and crystalline blocks. The adhesive is substantially tackifier-free.

A disposable absorbent article for wearing about the lower torso of a wearer is provided. The disposable absorbent article has a chassis including: a topsheet; a backsheet containing a polymeric film; and an absorbent core disposed between the topsheet and the backsheet. The polymeric film is at least 20 mm more narrow than the chassis. The disposable absorbent article has an opacity strengthening patch disposed on the backsheet, wherein the opacity strengthening patch is connected to one of the group consisting of the leg gasketing system, the polymeric film layer, and the backsheet by an adhesive. The adhesive includes: an amorphous polyolefin composition and a heterophase polyolefin composition having an amorphous character and crystalline blocks. The adhesive is substantially tackifier-free.

An object of the present invention is to provide an adhesive composition and an adhesive sheet that are stably dissolved or dispersed in a solvent or a dispersion medium having low polarity, have high total light transmittance and have high-function antistatic properties. An adhesive composition including (A) an adhesive polymer comprising repeated structures which consist of one or more kinds of (meth)acryl-based, urethane-based, silicone-based and polyolefin-based unit structures, (B) a conductive polymer complex including a conjugated polymer, and a polyanion having a block copolymer structure, and (C) a nonaqueous solvent or dispersion medium, in which the conductive polymer complex is contained by 0.1 parts by mass or higher and lower than 10 parts by mass relative to 100 parts by mass of the adhesive polymer.