The present application discloses an adhesive composition comprising a polymer of the formulae A, B and C and methods for using the adhesive composition.

The disclosure relates to a hydrogenated styrenic block copolymer with high vinyl content, low viscosity, low order-disorder temperature and improved processability. The hydrogenated styrenic block copolymers can be extruded or molded with a minimum of additives. The hydrogenated styrenic block copolymers have high melt flows allowing for ease in processing such as injection molding, overmolding, dipping, extrusion, roto-molding, slush molding, fiber spinning, film making, 3D printing and foaming.

The disclosure relates to a hydrogenated styrenic block copolymer with high vinyl content, low viscosity, low order-disorder temperature and improved processability. The hydrogenated styrenic block copolymers can be extruded or molded with a minimum of additives. The hydrogenated styrenic block copolymers have high melt flows allowing for ease in processing such as injection molding, overmolding, dipping, extrusion, roto-molding, slush molding, fiber spinning, film making, 3D printing and foaming.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

The present invention provides a hot-melt adhesive having a sufficiently long usable time and exhibiting good strength and good heat resistance. The present invention relates to a hot-melt adhesive composition comprising a hydrocarbon cyclic polymer (A), an -olefin polymer (C), and a tackifying resin (D).

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, realize a top-emission OED and exhibit excellent handleability and processability, and an OED including the same.

The present invention provides an aqueous dispersion mixture comprising; an aqueous dispersion (A) that comprises a crystalline polyolefin (a) as a dispersoid thereof; an aqueous dispersion (B) that comprises a crystalline polyurethane (b) as a dispersoid thereof; and an aqueous dispersion (C) that comprises a non-crystalline polyurethane (c) as a dispersoid thereof, wherein the crystalline polyolefin (a) is a non-chlorine modified polyolefin, wherein the crystalline polyurethane (b) has a crystal melting heat amount equal to or larger than 3 J/g measured by differential scanning calorimetry, wherein the non-crystalline polyurethane (c) has a crystal melting heat amount smaller than 3 J/g measured by differential scanning calorimetry, and wherein the aqueous dispersion (B) comprises a non-volatile content of 30 parts by mass to 100 parts by mass and the aqueous dispersion (C) comprises a non-volatile content of 20 parts by mass to 80 parts by mass, relative to a non-volatile content of 100 parts by mass of the aqueous dispersion (A).

The present invention provides an aqueous dispersion mixture comprising; an aqueous dispersion (A) that comprises a crystalline polyolefin (a) as a dispersoid thereof; an aqueous dispersion (B) that comprises a crystalline polyurethane (b) as a dispersoid thereof; and an aqueous dispersion (C) that comprises a non-crystalline polyurethane (c) as a dispersoid thereof, wherein the crystalline polyolefin (a) is a non-chlorine modified polyolefin, wherein the crystalline polyurethane (b) has a crystal melting heat amount equal to or larger than 3 J/g measured by differential scanning calorimetry, wherein the non-crystalline polyurethane (c) has a crystal melting heat amount smaller than 3 J/g measured by differential scanning calorimetry, and wherein the aqueous dispersion (B) comprises a non-volatile content of 30 parts by mass to 100 parts by mass and the aqueous dispersion (C) comprises a non-volatile content of 20 parts by mass to 80 parts by mass, relative to a non-volatile content of 100 parts by mass of the aqueous dispersion (A).

Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.