The present invention relates to a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer containing a base polymer and a pigment, the pressure-sensitive adhesive sheet having a transmittance for light having wavelengths of 380-600 nm of 25% or less, transmittance for light having wavelengths 800-2,500 nm of 60% or greater, and a change in light transmittance in the wavelength range of 600 to 800 nm of 0.1%/nm or greater.

An adhesive sheet comprising at least a pressure sensitive adhesive layer, wherein the adhesive sheet has an adhesive strength to soda-lime glass of larger than 1 N/25 mm and 100 N/25 mm or less, a pressure sensitive adhesive that constitutes the pressure sensitive adhesive layer is formed of a pressure sensitive adhesive composition that contains a (meth)acrylic ester polymer (A), and the (meth)acrylic ester polymer (A) contains, as a monomer unit that constitutes the polymer, an ethylene carbonate-containing monomer having an ethylene carbonate structure represented by Formula (1) below.

##STR00001##

The present invention relates to an adhesive composition containing a polymer and an ionic liquid, in which an exudation amount of the ionic liquid is 0.002 mg/cm.sup.2 or more when an adhesive layer formed of the adhesive composition is allowed to adhere to an adherend and then is debonded after applying a voltage of 10 V for 10 seconds.

A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×10.sup.5 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

Provided is a PSA sheet that can combine bonding reliability and peeling removability, and further can be peeled off without causing deformation or damage to the adherend in various peeling modes. The PSA sheet provided by this invention has a PSA layer. The PSA sheet has a water-peel strength of 2 N/10 mm or less. The PSA sheet further has a stress at 100 % elongation of less than 30 MPa as well as a multiplication product (σf-εf) of fracture stress σf (MPa) and fracture strain εf (%) of 250 or greater.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23° C. to 400° C. in the air at a heating rate of 10° C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

The present invention provides an adhesive resin layer, which can prevent generation of air bubbles even when adhered to a substrate having a high level difference, and can maintain transparency, an adhesive resin film, a laminate, and a method of producing a laminate. More specifically, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein the adhesive resin composition contains an acrylic-based polymer, an acrylic-based monomer, and a thermopolymerization initiator, and an adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.