A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

A method for producing an electronic component having an electromagnetic shield includes: sticking a temporary protective material to a body to be processed having irregularities on a surface thereof; curing the temporary protective material by light irradiation; singularizing the body to be processed and the temporary protective material; forming a metal film at a part of the singularized body where the temporary protective material is not stuck; and detaching the singularized body having the metal film formed thereon from the temporary protective material. The temporary protective material is formed from a resin composition having a shear viscosity at 35° C. of 5000 to 30000 Pa.Math.s before photocuring and having an elastic modulus at 25° C. of 100 MPa or less and an elongation percentage of 35% or more in a tensile test, after photocuring by light irradiation with an exposure amount of 500 mJ/cm.sup.2 or greater.

Provided is a sticky cleaner for antimicrobial treatment capable of removing organic dirt deposited on an article surface and of providing antimicrobial properties to the surface. The sticky cleaner according to this invention comprises a dirt-collecting member that collects organic dirt as it comes in contact with the article surface. The dirt-collecting member comprises a PSA in an area that comes in contact with the article surface, with the PSA providing antimicrobial properties to the article surface upon contact with the surface. The PSA comprises a base polymer and an antimicrobial agent.

This invention provides a sticky cleaner used for removing organic dirt deposited on an article surface. The sticky cleaner comprises a dirt-collecting member that collects the organic dirt upon contact with the article surface. The dirt-collecting member has an acrylic PSA in an area that comes in contact with the article surface. The dirt-collecting member exhibits a hardness of 90 or less in the area that comes in contact with the article surface.

The present invention relates to an adhesive composition containing a polymer, an ionic liquid, and an orientation material, and an adhesive sheet including an adhesive layer formed from the adhesive composition. The adhesive composition can form an adhesive layer that has excellent adhesive strength when no voltage is applied and whose adhesive force is sufficiently decreased by applying a voltage.

A polyurethane adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first polyol component that includes glycerol monoester and a polyisocyanate, and a second polyol. A polyurethane prepolymer that includes the reaction product of glycerol monoester, a hydroxy functional triglyceride, and a poly isocyanate.