C09J133/00

Photocurable composition having adhesive properties

The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.

RESIN COMPOSITION AND ADHESIVE FILM AND CIRCUIT BOARD MADE OF THE SAME
20170275508 · 2017-09-28 ·

A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

RESIN COMPOSITION AND ADHESIVE FILM AND CIRCUIT BOARD MADE OF THE SAME
20170275508 · 2017-09-28 ·

A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is in an amount by weight of 150 parts in the resin composition, the non-photosensitive resin is in an amount by weight of 30 parts to 80 parts in the resin composition, the nano core-shell particles are in an amount by weight of 5 parts to 30 parts in the resin composition, and the photoinitiator is in an amount by weight of 1 part to 10 parts in the resin composition.

FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT USING THE FILM

To provide a film which is excellent in releasing property with respect to a resin sealed portion and excellent in low migration property and peeling property with respect to a semiconductor chip, a source electrode or a sealing glass and which is suitable as a mold release film for producing a semiconductor element having a part of the surface of a semiconductor chip, source electrode or sealing glass exposed. A film 1 which comprises a substrate 3 and an adhesive layer 5, wherein the storage elastic modulus at 180° C. of the substrate 3 is from 10 to 100 MPa, and the adhesive layer 5 is a reaction cured product of a composition for adhesive layer comprising a specific acrylic polymer and a polyfunctional isocyanate compound, wherein the number of moles M.sub.OH of hydroxy groups and the number of moles M.sub.COOH of carboxy groups, derived from the acrylic polymer, and the number of moles M.sub.NCO of isocyanate groups derived from the polyfunctional isocyanate compound, satisfy a specific relation, and which is suitable as a mold release film for producing a semiconductor element.

Pressure-sensitive adhesive layers with surface-enriched stripes and methods of making

Herein are disclosed a pressure-sensitive adhesive layer on a substrate, the adhesive layer containing stripes of first and second pressure-sensitive adhesives. The surface of the adhesive layer that faces the substrate is surface-enriched with the first pressure-sensitive adhesive. Methods of making are disclosed.

Pressure-sensitive adhesive layers with surface-enriched stripes and methods of making

Herein are disclosed a pressure-sensitive adhesive layer on a substrate, the adhesive layer containing stripes of first and second pressure-sensitive adhesives. The surface of the adhesive layer that faces the substrate is surface-enriched with the first pressure-sensitive adhesive. Methods of making are disclosed.

RADIATION CURABLE PRIMER ADHESIVE
20220041892 · 2022-02-10 ·

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

RADIATION CURABLE PRIMER ADHESIVE
20220041892 · 2022-02-10 ·

The present invention involves a 100% solids, radiation curable adhesive formulation for adhesion to EVA. This formulation may have varying compositions, as discussed in detail herein. However primarily the composition may comprise at least a monomer, and a chlorinated additive. Photo initiators may be used to allow for low temperature UV or other radiation curing. Other additives may be used to enhance functional features in various ways. In use, the present invention may be coated on a surface of EVA and then cured, and may be adhered to a substrate using only a layer of adhesive on the substrate, in contrast to the structures of the prior art, which require at least two sided adhesive application, among other complexities.

BASE PAPER FOR PAPER TUBE, AND PAPER TUBE
20220042247 · 2022-02-10 ·

An object is to provide a base paper for paper tubes that has lower environmental impact and is used for manufacturing of paper tubes offering excellent water resistance. As a solution, a base paper for paper tubes is provided, wherein: it has two or more but no more than five paper layers; the paper layers are bonded by a water-soluble or water-dispersible adhesive; and its elution rate is 2.0 percent or lower.

IMAGE DISPLAY PANEL AND IMAGE DISPLAY DEVICE

The present invention provides an image display panel including an image display unit and an optical film including a polarizing film provided on a viewing side of the image display unit via a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a degree of swelling with oleic acid of more than 130% and 190% or less, and the image display panel has a flat edge face. The image display panel with a bezel can preventing peeling-off of the pressure-sensitive adhesive layer even when placed in a humidified environment in a state where fat and oil or cream components are in contact with the elastic intermediate layer. The image display panel of the present invention can prevent peeling-off of the pressure-sensitive adhesive layer even when placed in a humidified environment in a state where fat and oil or cream components are in contact with the elastic intermediate layer.