Patent classifications
C09J133/00
Laminated film for fiber adhesion and/or fiber sheet surface protection and thermosetting composition for fiber adhesion and/or fiber sheet surface protection
The present invention relates to a laminated film for fiber adhesion and/or fiber sheet surface protection in which a layer [I] containing a thermosetting composition [i] and a support film [II] are laminated, wherein the thermosetting composition [i] contains a thermal polymerization initiator (C) having a 10-hour half-life temperature of 65° C. or higher.
Laminated film for fiber adhesion and/or fiber sheet surface protection and thermosetting composition for fiber adhesion and/or fiber sheet surface protection
The present invention relates to a laminated film for fiber adhesion and/or fiber sheet surface protection in which a layer [I] containing a thermosetting composition [i] and a support film [II] are laminated, wherein the thermosetting composition [i] contains a thermal polymerization initiator (C) having a 10-hour half-life temperature of 65° C. or higher.
OLED PANEL LOWER PART PROTECTION FILM, AND ORGANIC LIGHT-EMITTING DISPLAY APPARATUS COMPRISING SAME
A lower part protection film for an OLED panel is provided. More particularly, a lower part protection film for an OLED panel, having a significantly improved recognition rate of an alignment process, being capable of preventing generation of static electricity through an antistatic treatment, and having excellent adhesion to an OLED panel at the same time, and an organic light-emitting display apparatus including the lower part protection film for an OLED panel are provided.
Temporary protective film for semiconductor sealing molding
Disclosed is a temporary protective film for semiconductor sealing molding 10 including a support film 1; and an adhesive layer 2 provided on the support film 1 and containing an acrylic rubber. A solid shear modulus at 200° C. of the temporary protective film for semiconductor sealing molding 10 may be 5.0 MPa or higher.
Waterproof Cover
Provided is a waterproof cover having a waterproof membrane, and a PSA sheet laminated peripherally to the waterproof membrane. The PSA sheet comprises a PSA layer bonded to the waterproof membrane. The PSA layer is formed of a PSA having a storage modulus G′ of 53000 Pa or higher at 40° C.
PRESSURE-SENSITIVE ADHESIVE TAPE AND METHOD FOR MOLDING PLASTIC LENS
A pressure-sensitive adhesive tape for molding a plastic lens having a substrate and a pressure-sensitive adhesive layer formed on a surface of the substrate. The pressure-sensitive adhesive layer includes an acrylic copolymer having a functional group and a crosslinking agent capable of reacting with the functional group; the acrylic copolymer has a weight-average molecular weight (M.sub.w) of 1,100,000 or more and a molecular-weight polydispersity (M.sub.w/M.sub.n) of 10.0 or less; the pressure-sensitive adhesive layer has an elution percentage of 48.0% or less when immersed for two hours in toluene the temperature of which being adjusted to 80° C.; the pressure-sensitive adhesive tape exhibits a shift length of 0.15 mm or more and 0.50 mm or less after 800 minutes in a creep test; and the plastic lens has a refractive index of 1.59 or more.
ADHESIVE COMPOSITION, ADHESIVE LAYER AND ADHESIVE SHEET
The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
ADHESIVE COMPOSITION, ADHESIVE LAYER AND ADHESIVE SHEET
The present invention relates to an adhesive composition containing a base polymer, a water-absorbing material, and a moisture-curable component, wherein the moisture-curable component is contained in an unreacted state, an adhesive layer made from the adhesive composition, and an adhesive sheet including the adhesive layer.
TRANSPARENT LIGHT-EMITTING DEVICE DISPLAY
A transparent light emitting device display comprising: a transparent substrate; a conductive metal pattern provided on the transparent substrate; a light emitting device provided on at least a part of the conductive metal pattern; a first transparent adhesive layer provided on the transparent substrate, the conductive metal pattern, and the light emitting device; a UV-cut film provided on the first transparent adhesive layer; and a second transparent adhesive layer provided on the UV-cut film.
HIGH PRESSURE PROCESSING INDICATOR
A device for indicating exposure to a pressure. The device may include a base layer, a plurality of microcapsules, and a coating, with the microcapsules being disposed between the base layer and the coating. The microcapsules contain a indicator material that can be released once the microcapsules burst. The microcapsules then have a compressive bursting strength that is chosen or designed to be less than a selected pressure (e.g., the pressure being that to which a particular article may be exposed during high pressure processing). Thus, when the device is subjected to a pressure greater than the compressive bursting strength, at least some microcapsules burst, the indicator material is released from the microcapsules, and the release of the indicator material can be detected by observation of the device. The device may be a label that is associated (such as by being affixed) to the article being subjected to pressure (or multiple labels being associated (such as by being affixed) to multiple articles. Alternatively, the device may be associated with an article or articles without being affixed thereto.