A green, safe and environmentally-friendly process and production equipment for industrialized continuous large-scale production of a formaldehyde-free water-based adhesive; the process includes: performing a polymerization reaction on a monomer having a carbon-carbon unsaturated double bond and an acid anhydride group and at least one other monomer containing a carbon-carbon unsaturated double bond that serve as raw materials in the presence of a solvent and an initiator; and performing solid-liquid separation on the polymerization reaction solution under the action of a high-temperature inert carrier gas, vaporizing, condensing, and recovering the solvent for indiscriminate use in polymerization reaction, and performing a gas-solid reaction on the solid material serving as a polymer intermediate and a mixed gas of ammonia gas and air to obtain a solid formaldehyde-free water-based adhesive product.

A green, safe and environmentally-friendly process and production equipment for industrialized continuous large-scale production of a formaldehyde-free water-based adhesive; the process includes: performing a polymerization reaction on a monomer having a carbon-carbon unsaturated double bond and an acid anhydride group and at least one other monomer containing a carbon-carbon unsaturated double bond that serve as raw materials in the presence of a solvent and an initiator; and performing solid-liquid separation on the polymerization reaction solution under the action of a high-temperature inert carrier gas, vaporizing, condensing, and recovering the solvent for indiscriminate use in polymerization reaction, and performing a gas-solid reaction on the solid material serving as a polymer intermediate and a mixed gas of ammonia gas and air to obtain a solid formaldehyde-free water-based adhesive product.

A curable composition which has high curability and high transparency, while exhibiting good adhesion to various base materials, and which is used in both an aqueous system and an organic system and is applied to UV curing and/or thermal curing; a coating agent composition, a bonding agent composition, an adhesive composition, an ink composition, an aqueous ink composition, an ink composition for three-dimensional modeling, an aqueous coating material composition, a sealing agent composition, a nail cosmetic composition, a dental material and a decorative coating agent, each of which contains this curable composition; and cured products and molded articles of these materials. A curable composition contains: (A) a water-insoluble multifunctional (meth)acrylamide; and (B) a polymerizable compound other than the component (A).

A curable composition which has high curability and high transparency, while exhibiting good adhesion to various base materials, and which is used in both an aqueous system and an organic system and is applied to UV curing and/or thermal curing; a coating agent composition, a bonding agent composition, an adhesive composition, an ink composition, an aqueous ink composition, an ink composition for three-dimensional modeling, an aqueous coating material composition, a sealing agent composition, a nail cosmetic composition, a dental material and a decorative coating agent, each of which contains this curable composition; and cured products and molded articles of these materials. A curable composition contains: (A) a water-insoluble multifunctional (meth)acrylamide; and (B) a polymerizable compound other than the component (A).

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to Ar.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents CO, S, or SO.sub.2, and Y represents S, SO.sub.2, O, CO, COO, or CONH. n represents an integer of 0 or greater. ##STR00001##

Provided is a curable composition having excellent workability and being capable of forming a cured product having super heat resistance by curing. The curable composition of the present disclosure includes a curable compound represented by Formula (1) below and a radical polymerization initiator. In the following formula, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. Ar.sup.1 to Ar.sup.3 each represent an arylene group or a group in which two or more arylene groups are bonded via a single bond or a linking group. X represents CO, S, or SO.sub.2, and Y represents S, SO.sub.2, O, CO, COO, or CONH. n represents an integer of 0 or greater. ##STR00001##