In a method for the manufacture of a hydrocarbon resin made of at least one cyclic diolefin component and at least one ethylenically unsaturated aromatic component having 8 to 13 carbon atoms, the monomer mixture is heated to a polymerisation temperature of at least 180° C. at a heating speed of 0.5 to 10° C./second to obtain a hydrocarbon resin with a reduced amount of by-products, wherein the monomer mixture is essentially liquid in a single phase during the heating to at least 180° C. and during polymerisation, and the subsequently hydrogenated hydrocarbon resin has good compatibility with other components of hot-melt adhesives.

In a method for the manufacture of a hydrocarbon resin made of at least one cyclic diolefin component and at least one ethylenically unsaturated aromatic component having 8 to 13 carbon atoms, the monomer mixture is heated to a polymerisation temperature of at least 180° C. at a heating speed of 0.5 to 10° C./second to obtain a hydrocarbon resin with a reduced amount of by-products, wherein the monomer mixture is essentially liquid in a single phase during the heating to at least 180° C. and during polymerisation, and the subsequently hydrogenated hydrocarbon resin has good compatibility with other components of hot-melt adhesives.

An adhesive composition is intended to provide the attaching to human skin, comprising a continuous phase and a discontinuous phase of hydrocolloids, with the continuous phase comprising by weight, based on the total weight of the adhesive composition: (i) 1 to 12% by weight of a sequenced polymer of the styrene-isoprene-styrene or styrene-butadiene-styrene type, (ii) (a) 1 to 15% of a polymer of the elastomer butyl type, possibly as a mixture with up to 25% by weight of a polymer of the polyisobutylene type, or (b) more than 10% to 30% of a polymer of the polyisobutylene type, free of polymer of the elastomer butyl type, (iii) 1 to less than 10% of a polymer of the ethylene vinyl acetate type, with the sum of these three types of polymers representing from 10 to 40%.

Provided are a method of preparing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin. According to the present invention, provided is a dicyclopentadiene-based resin including an aromatic olefin-based comonomer as a comonomer to have improved quality including high compatibility, a favorable color characteristic, and a low softening point, and also having improved adhesive strength due to a low molecular weight and a narrow molecular weight distribution.

Provided are a method of preparing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin. According to the present invention, provided is a dicyclopentadiene-based resin including an aromatic olefin-based comonomer as a comonomer to have improved quality including high compatibility, a favorable color characteristic, and a low softening point, and also having improved adhesive strength due to a low molecular weight and a narrow molecular weight distribution.

The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.

The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. ##STR00001## wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of O, S, CO, and NH, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a cationically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a cationic polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. ##STR00001## wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of O, S, CO, and NH, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

The present invention relates to: a dicyclopentadiene-based resin having excellent compatibility with a base resin and prepared by being copolymerized with a monomer composition comprising a dicyclopentadiene-based monomer and a vinylamide-based monomer; a dicyclopentadiene-based hydrogenated resin; and an adhesive resin composition comprising same. A dicyclopentadiene-based resin according to the present invention is advantageous in terms of having excellent compatibility with various base resins and being providable as an adhesive resin composition capable of achieving remarkably improved adhesive strength.