Provided are a method of preparing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin. According to the present invention, provided is a dicyclopentadiene-based resin including an aromatic olefin-based comonomer as a comonomer to have improved quality including high compatibility, a favorable color characteristic, and a low softening point, and also having improved adhesive strength due to a low molecular weight and a narrow molecular weight distribution.

Provided are a method of preparing a dicyclopentadiene-based resin and a dicyclopentadiene-based resin. According to the present invention, provided is a dicyclopentadiene-based resin including an aromatic olefin-based comonomer as a comonomer to have improved quality including high compatibility, a favorable color characteristic, and a low softening point, and also having improved adhesive strength due to a low molecular weight and a narrow molecular weight distribution.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).

Provided is a thermoplastic resin composition or an adhesive coating material capable of adhering a cyclic polyolefin-based polymer with a metal or metal compound such as aluminum foil or an ethylene-vinyl alcohol copolymer with sufficient strength. The thermoplastic resin composition contains (A) 100 parts by mass of thermoplastic resin; (B) 0.05 to 5 parts by mass of one or more kinds selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid derivative; and (C) 0.01 to 3 parts by mass of organic peroxide; which component (A) contains (a1) 10 to 90% by mass cyclic polyolefin-based polymer; and (a2) 90 to 10% by mass a hydrogenated product of a block copolymer comprising a polymer block composed mainly of an aromatic vinyl compound and a random copolymer block of a conjugated diene compound and an aromatic vinyl compound (with the proviso that the total of the component (a1) and the component (a2) is 100% by mass).

The resin composition incudes a polymer compound represented by the formula (1), where in formula (1), R.sub.1 and R.sub.2 each independently represent a hydrogen atom or a methyl group, and m and n represent the average numbers of repeating units, and are each independently in the range between 1 and 2000 inclusive; a compound that can radically polymerize with the polymer compound; and a radical initiator. The compound that can radically polymerize with the polymer compound is at least one selected from the group consisting of phenylmaleimide compounds, acenaphthylene compounds, modified polyphenylene ether resins having an unsaturated double bond at an end, and aryl isocyanurate compounds.

Presented and described is a hydrocarbon resin obtainable by thermal polymerization of a cyclic diolefin component including a cyclic diolefin compound with an aromatic component including indene and/or C.sub.1-4-alkylindene, with the hydrocarbon resin having a polydispersity index (PDI) of 1 to less than 2.3. Further described is a production process for the hydrocarbon resin, wherein a monomer mixture which includes an aromatic component including indene and/or C.sub.1-4-alkylindene and a cyclic diolefin component including a cyclic diolefin compound is polymerized by heating to a polymerization temperature of at least 180? C. to give a product stream including hydrocarbon resin, and oligomers which include units originating from the cyclic diolefin compound and/or units originating from the aromatic component are separated from the product stream and returned to the monomer mixture. Lastly described are a hydrogenated hydrocarbon resin, a process for production thereof, and the use of the hydrocarbon resin and of the hydrogenated hydrocarbon resin.