A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260 C.; and 5 to 35 volume percent inorganic filler.

A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260 C.; and 5 to 35 volume percent inorganic filler.

Water-based adhesive composition comprising: from 30% to 60% by weight (expressed as dry content) of a chloroprene modified acrylic emulsion (A); and from 0.05% to 0.45% by weight (expressed as dry content) of a water soluble polymer (B) selected among xanthan gum and konjac gum; said composition being obtainable by a process (P) comprising a first step (i) of dissolving into water polymer (B) in the form of a powdered solid.

Use of said composition, for the bonding of at least one cellulose based substrate.

Water-based adhesive composition comprising: from 30% to 60% by weight (expressed as dry content) of a chloroprene modified acrylic emulsion (A); and from 0.05% to 0.45% by weight (expressed as dry content) of a water soluble polymer (B) selected among xanthan gum and konjac gum; said composition being obtainable by a process (P) comprising a first step (i) of dissolving into water polymer (B) in the form of a powdered solid.

Use of said composition, for the bonding of at least one cellulose based substrate.

The present invention relates to a composition comprising at least one polydiene, preferably at least one polybutadiene, at least two transition metal compounds, at least one silicon compound having at least one vinyl group and having at least two silicon atoms, and at least one wetting agent, where the composition has an Mn compound and a Zr compound as organic transition metal compounds, and to the use of this composition as or for the production of a joint compound, joint sealant, adhesive, putty, filling compound or vibration-damping compound.

The present invention relates to a composition comprising at least one polydiene, preferably at least one polybutadiene, at least two transition metal compounds, at least one silicon compound having at least one vinyl group and having at least two silicon atoms, and at least one wetting agent, where the composition has an Mn compound and a Zr compound as organic transition metal compounds, and to the use of this composition as or for the production of a joint compound, joint sealant, adhesive, putty, filling compound or vibration-damping compound.

A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition.

The present invention is in the field of an improved adhesive composition, use of said composition and products comprising said composition. The adhesive composition may be a one component and a two component adhesive, each component typically comprising various ingredients. The present adhesives are water-based dispersions.

The present invention is in the field of an improved adhesive composition, use of said composition and products comprising said composition. The adhesive composition may be a one component and a two component adhesive, each component typically comprising various ingredients. The present adhesives are water-based dispersions.

A low viscosity polymer having a linear or branched backbone derived from farnesene monomers and at least one terminal-end functionalized with a hydroxyl group. This polymer may be further hydrogenated to reduce unsaturation and acrylated, such that it may be incorporated into a LOCA composition. The LOCA composition may be used in a laminated screen assembly, such as a touch screen, for electronic devices by adhering the LOCA composition between an optically transparent layer, such as a cover glass, and a display. The cured LOCA composition has a refractive index similar to the optically transparent layer. A method of making the low viscosity polymer for the LOCA composition includes anionically polymerizing farnesene monomers, quenching a living end of the polymer to provide the hydroxyl-terminated polymer; hydrogenating the hydroxyl-terminated polymer; and reacting the at least partially saturated hydroxyl-terminated polymer with at least one reagent to provide an acrylate terminated hydrogenated polymer.