A method for the reversible crosslinking of, for example, adhesives or coating materials, and a composition stable on storage at room temperature for implementing the crosslinking reaction. The reversible crosslinking method allows very rapid crosslinking even at a low first temperature, and undoing of the crosslinks at higher temperatures, thereby recovering thermoplastic processability and, for example, allowing the originally bonded substrates to be parted from one another again easily. A particular aspect is that a plurality of cycles of crosslinking and undoing of the crosslinks are possible with the present system. A feature of the system used for the reversible crosslinking is that it contains two components, A and B, where component A is a compound having at least two protected dithioester functionalities, preferably cyanodithioester functionalities, and component B is a compound having at least two diene functionalities.

A method for the reversible crosslinking of, for example, adhesives or coating materials, and a composition stable on storage at room temperature for implementing the crosslinking reaction. The reversible crosslinking method allows very rapid crosslinking even at a low first temperature, and undoing of the crosslinks at higher temperatures, thereby recovering thermoplastic processability and, for example, allowing the originally bonded substrates to be parted from one another again easily. A particular aspect is that a plurality of cycles of crosslinking and undoing of the crosslinks are possible with the present system. A feature of the system used for the reversible crosslinking is that it contains two components, A and B, where component A is a compound having at least two protected dithioester functionalities, preferably cyanodithioester functionalities, and component B is a compound having at least two diene functionalities.

The present invention relates to an adhesive composition and an organic electronic device comprising the same, and provides an adhesive composition which can form a encapsulating structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, and can improve processability by being easily applied in the process of forming the encapsulating structure of the organic electronic device, thereby preventing problems that air bubbles flow into the inside of the encapsulating structure or application nozzles are clogged, and an organic electronic device comprising the same.

The present invention relates to an adhesive composition and an organic electronic device comprising the same, and provides an adhesive composition which can form a encapsulating structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, and can improve processability by being easily applied in the process of forming the encapsulating structure of the organic electronic device, thereby preventing problems that air bubbles flow into the inside of the encapsulating structure or application nozzles are clogged, and an organic electronic device comprising the same.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

Disclosed are exemplary one-part dispensables (broadly, composites) configured to be usable with reduced spreading of material(s), if any, migrating therefrom (e.g., reduced oil bleed spreading, etc.) and good vertical stability (e.g., vertically stable during thermal cycling and/or vibration, etc.). Also disclosed are exemplary methods for reducing the spreading of material(s), if any, migrating (e.g., reducing oil bleeding, etc.) from one-part dispensables and/or for improving or providing good vertical stability of the one-part dispensables. The one-part dispensables may comprise thermal management and/or electromagnetic interference (EMI) mitigation materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally-conductive EMI absorbers, electrically-conductive elastomers (ECEs), electrically-conductive composites, combinations thereof, etc.) or other polymer-inorganic composite materials used for other purposes.

Disclosed are exemplary one-part dispensables (broadly, composites) configured to be usable with reduced spreading of material(s), if any, migrating therefrom (e.g., reduced oil bleed spreading, etc.) and good vertical stability (e.g., vertically stable during thermal cycling and/or vibration, etc.). Also disclosed are exemplary methods for reducing the spreading of material(s), if any, migrating (e.g., reducing oil bleeding, etc.) from one-part dispensables and/or for improving or providing good vertical stability of the one-part dispensables. The one-part dispensables may comprise thermal management and/or electromagnetic interference (EMI) mitigation materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally-conductive EMI absorbers, electrically-conductive elastomers (ECEs), electrically-conductive composites, combinations thereof, etc.) or other polymer-inorganic composite materials used for other purposes.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.