Provided is a polymerizable composition comprising a cycloolefin-based monomer having a specific structure, a silane coupling agent having at least one hydrocarbon group having a norbornene structure, and a metathesis polymerization catalyst.

Provided is a polymerizable composition comprising a cycloolefin-based monomer having a specific structure, a silane coupling agent having at least one hydrocarbon group having a norbornene structure, and a metathesis polymerization catalyst.

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

Pressure-sensitive adhesives based on acrylonitrile-butadiene rubbers having good shock-resistance combined with easy removability of the adhesives from the substrate shall be provided. This is solved by a pressure-sensitive adhesive which comprises at least one acrylonitrile-butadiene rubber; and at least one tackifier resin, and is characterized in that the acrylonitrile content of the acrylonitrile rubber is less than 30 wt %; the pressure-sensitive adhesive comprises at least one rosin resin as tackifier resin; and the entirety of all tackifier resins has an acid number of 6-150. The pressure-sensitive adhesive can be used for bonding parts in mobile electronic devices.

The present application relates to an adhesive composition comprising a polypropylene resin, a tackifying resin and a plasticizer resin having a superior balance of properties in regard of Brookfield viscosity and maximum probe tack. It further relates to an article comprising the adhesive composition and to a process for producing said article. The application also relates to the use of the adhesive composition in the preparation of an article.

The present application relates to an adhesive composition comprising a polypropylene resin, a tackifying resin and a plasticizer resin having a superior balance of properties in regard of Brookfield viscosity and maximum probe tack. It further relates to an article comprising the adhesive composition and to a process for producing said article. The application also relates to the use of the adhesive composition in the preparation of an article.

A macromonomer precursor is provided that includes a polymeric chain derived from farnesene and a single functional terminal end. The functional terminal end may include a hydroxyl group, an amino group, an epoxy group, an isocyanato group, or a carboxylic acid group. The terminal end of the macromonomer precursor may then be reacted with a (meth)acrylate to form a macromonomer having a (meth)acrylate functionalized terminal end that may be (co)polymerized with radically polymerizable monomers, such as alkyl(meth)acrylate monomers. Alternatively, a copolymer may be obtained by first deriving a poly(meth)acrylate from (meth)acrylate monomers having reactive groups that would allow the macromonomer precursors to be grafted onto the poly(meth)acrylate in a second step. The resulting copolymer may be incorporated as an additive in various formulations, such as a lubricant, a hydraulic fluid, a cosmetic composition, and an adhesive composition.

A macromonomer precursor is provided that includes a polymeric chain derived from farnesene and a single functional terminal end. The functional terminal end may include a hydroxyl group, an amino group, an epoxy group, an isocyanato group, or a carboxylic acid group. The terminal end of the macromonomer precursor may then be reacted with a (meth)acrylate to form a macromonomer having a (meth)acrylate functionalized terminal end that may be (co)polymerized with radically polymerizable monomers, such as alkyl(meth)acrylate monomers. Alternatively, a copolymer may be obtained by first deriving a poly(meth)acrylate from (meth)acrylate monomers having reactive groups that would allow the macromonomer precursors to be grafted onto the poly(meth)acrylate in a second step. The resulting copolymer may be incorporated as an additive in various formulations, such as a lubricant, a hydraulic fluid, a cosmetic composition, and an adhesive composition.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.