A hot melt adhesive (HMA) composition comprises: a) an ethylene/alpha-olefin multi-block interpolymer that has a melt viscosity (177° C.)≤50,000 mPa.Math.s; b) an anhydride and/or carboxylic acid functionalized propylene-based polymer that has a melt viscosity (190° C.)≤50,000 mPa.Math.s; c) a tackifier; and d) a wax. Such composition delivers both a high temperature heat resistance and a fast set time.

A hot melt adhesive (HMA) composition comprises: a) an ethylene/alpha-olefin multi-block interpolymer that has a melt viscosity (177° C.)≤50,000 mPa.Math.s; b) an anhydride and/or carboxylic acid functionalized propylene-based polymer that has a melt viscosity (190° C.)≤50,000 mPa.Math.s; c) a tackifier; and d) a wax. Such composition delivers both a high temperature heat resistance and a fast set time.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

Two-part silane modified polymer/free radically curable adhesive systems demonstrating improved strength and percent elongation are provided.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.