The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160° C. (η1) of 20000 mPa.Math.s or less and a melt viscosity at 180° C. (η2) of 10000 mPa.Math.s or less, wherein the ratio of the melt viscosity at 160° C. (η1) to the melt viscosity at 180° C. (η2) (η1/η2) is 1.0 to 5.0.

Methods and materials to fabricate electrochromic including electrochemical devices are disclosed. In particular, emphasis is placed on the composition, fabrication and incorporation of electrolytic sheets in these devices. Composition, fabrication and incorporation of redox layers and sealants suitable for these devices are also disclosed. Incorporation of EC devices in insulated glass system (IGU) windows is also disclosed.

Methods and materials to fabricate electrochromic including electrochemical devices are disclosed. In particular, emphasis is placed on the composition, fabrication and incorporation of electrolytic sheets in these devices. Composition, fabrication and incorporation of redox layers and sealants suitable for these devices are also disclosed. Incorporation of EC devices in insulated glass system (IGU) windows is also disclosed.

Acrylic copolymers that include the controlled placement of functional groups within the polymer structure are provided. The copolymers contain a reactive segment and a non-reactive segment and are manufactured via a controlled radical polymerization process. The copolymers are useful in the manufacture of adhesives and elastomers.

Acrylic copolymers that include the controlled placement of functional groups within the polymer structure are provided. The copolymers contain a reactive segment and a non-reactive segment and are manufactured via a controlled radical polymerization process. The copolymers are useful in the manufacture of adhesives and elastomers.

Acrylic copolymers that include the controlled placement of functional groups within the polymer structure are provided. The copolymers contain a reactive segment and a non-reactive segment and are manufactured via a controlled radical polymerization process. The copolymers are useful in the manufacture of adhesives and elastomers.

In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 100 g/mole to less than 15,000 g/mole. In some embodiments, the adhesive composition is a pressure sensitive adhesive.

In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 100 g/mole to less than 15,000 g/mole. In some embodiments, the adhesive composition is a pressure sensitive adhesive.

A composition comprising, in weight percent (wt %) based on the weight of the composition: (A) greater than zero to 39 wt % of at least one of a polar olefin polymer and a styrenic block copolymer; (B) greater than zero to 20 wt % of an epoxy or amine-functionalized silane; (C) 60 to 99 wt % of an organic solvent for a mixture of (1) the polar olefin polymer and/or styrenic block copolymer, and (2) the epoxy or amine-functionalized silane; and (D) zero to 10 wt % of a polyisocyanate crosslinking agent.

A composition comprising, in weight percent (wt %) based on the weight of the composition: (A) greater than zero to 39 wt % of at least one of a polar olefin polymer and a styrenic block copolymer; (B) greater than zero to 20 wt % of an epoxy or amine-functionalized silane; (C) 60 to 99 wt % of an organic solvent for a mixture of (1) the polar olefin polymer and/or styrenic block copolymer, and (2) the epoxy or amine-functionalized silane; and (D) zero to 10 wt % of a polyisocyanate crosslinking agent.