The present invention relates to a pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition of the present invention can provide a pressure-sensitive adhesive having low time-dependency of dependability and adhesion strength and having excellent interfacial adhesion strength. After being applied to an optical member such as a polarizing plate, the pressure-sensitive adhesive composition exhibits excellent interfacial adhesion strength and maintains excellent dependability without time-dependency.

Adhesive compositions and articles containing the adhesive compositions are provided. In some embodiments, the adhesive compositions can be positioned adjacent to biological surfaces such as skin. For example, articles are provided that can be used in wound dressing or that can be used to stabilize and/or affix a medical device or medical instrument to a patient.

Adhesive compositions and articles containing the adhesive compositions are provided. In some embodiments, the adhesive compositions can be positioned adjacent to biological surfaces such as skin. For example, articles are provided that can be used in wound dressing or that can be used to stabilize and/or affix a medical device or medical instrument to a patient.

Adhesive compositions and articles containing the adhesive compositions are provided. In some embodiments, the adhesive compositions can be positioned adjacent to biological surfaces such as skin. For example, articles are provided that can be used in wound dressing or that can be used to stabilize and/or affix a medical device or medical instrument to a patient.

A hot melt adhesive composition includes (A) 10-95 wt % of a random or homogeneous propylene-based interpolymer having: (i) a comonomer content of at least one of C2 and C4-10 a-olefin of 7 wt % to 49 wt % based on the total weight of the propylene-based interpolymer, (ii) an MWD of 4 or less, (iii) a density of 0.90 g/cc or less, and (iv) a Brookfield viscosity of less than 50,000 centipoise, (B) 1-60 wt % of a crystalline block composite comprising: (1) a crystalline ethylene based polymer; (2) a crystalline alpha-olefin based polymer derived from at least one of a C3-10 a-olefin; and (3) a block copolymer comprising 10-90 wt % of a crystalline ethylene block comprising greater than 90 mol % units derived from ethylene and comprising 10-90 wt % of a crystalline alpha-olefin block comprising greater than 90 mol % units derived from at least one of a C3-10 a-olefin, (C) Optionally, from greater than zero to 70 wt % tackifier, and (D) Optionally, from greater than zero to 40 wt % of at least one selected from the group of a wax and an oil.

A cling foil comprising an outermost adhesive layer comprising a pressure sensitive adhesive, an outermost release layer, the outermost release layer comprising a release material, and a foil layer positioned between the outermost adhesive layer and the outermost release layer.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m.sup.2d, preferably of less than 50 g/m.sup.2d, especially less than 15 g/m.sup.2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.

A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.