The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90 C. to 150 C.; and c) a wax.

The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90 C. to 150 C.; and c) a wax.

The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90 C. to 150 C.; and c) a wax.

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).
0.85W.sub.0.05h/2f1.30(1)
(The definitions of the symbols are omitted.)

The present invention relates to an aqueous emulsion including an ethylenically unsaturated monomer unit-containing polymer as a dispersoid and a polyvinyl alcohol as a dispersant. The content of a free polyvinyl alcohol in the aqueous emulsion is 0.2 to 20 parts by mass relative to 100 parts by mass of the ethylenically unsaturated monomer unit-containing polymer. The free polyvinyl alcohol has a degree of saponification of 80.0 to 99.5 mol % and a viscosity-average degree of polymerization of 200 to 5000, and the free polyvinyl alcohol has a symmetry factor (W.sub.0.05h/2f) that satisfies the following expression (1) as determined by gradient high-performance liquid chromatography for reversed-phase separation using a water-acetone eluent according to JIS K 0124 (2011).
0.85W.sub.0.05h/2f1.30(1)
(The definitions of the symbols are omitted.)

A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.

An adhesive composition including a resin and an electro-conductive material, wherein the electro-conductive material is one or more salts selected from sodium salt, potassium salt, and calcium salt having two fluorosulfonic acid structures per molecule and 5 or more carbon atoms shown by formula (1): .sup.O.sub.3SYLa-A-Lb-YSO.sub.3.sup. (M.sup.n+).sub.2/n (1), wherein, A represents a divalent hydrocarbon group having 1-30 carbon atoms and optionally substituted by a heteroatom or optionally interposed by a heteroatom; La and Lb each represent a linking group like an ether group, ester group; Y represents an alkylene group having 2-4 carbon atoms, containing 1-6 fluorine atoms, and optionally containing a carbonyl group; M.sup.n+ represents any of Na.sup.+, K.sup.+, Ca.sup.2+. This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility, and light weight, which can be manufactured at low cost and without large lowering of electric conductivity even when it is wetted with water or dried.

An adhesive composition including a resin and an electro-conductive material, wherein the electro-conductive material is one or more salts selected from sodium salt, potassium salt, and calcium salt having two fluorosulfonic acid structures per molecule and 5 or more carbon atoms shown by formula (1): .sup.O.sub.3SYLa-A-Lb-YSO.sub.3.sup. (M.sup.n+).sub.2/n (1), wherein, A represents a divalent hydrocarbon group having 1-30 carbon atoms and optionally substituted by a heteroatom or optionally interposed by a heteroatom; La and Lb each represent a linking group like an ether group, ester group; Y represents an alkylene group having 2-4 carbon atoms, containing 1-6 fluorine atoms, and optionally containing a carbonyl group; M.sup.n+ represents any of Na.sup.+, K.sup.+, Ca.sup.2+. This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility, and light weight, which can be manufactured at low cost and without large lowering of electric conductivity even when it is wetted with water or dried.

The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of D.sub.f (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.

The present application provides a resin composition, and the resin composition comprises the following components: (A) a resin containing unsaturated bonds, (B) an initiator, and (C) an inorganic filler which has been subjected to surface treatment by a silane coupling agent; the silane coupling agent contains a structure shown in formula (I). In the present application, the inorganic filler is subjected to surface treatment by a silane coupling agent containing the structure shown in formula (I), which can improve the binding force at the interface between the inorganic filler and the unsaturated resin matrix, and the prepared insulating adhesive film has excellent dielectric properties, good dielectric stability, and a small change amplitude of D.sub.f (10 GHz) after HAST, which can be applied to a high-frequency and high-speed printed circuit board prepared by a semi-additive process or additive process.