The present invention has been made in an effort to provide an adhesive coating composition capable of adhering (fastening) a non-oriented electrical steel sheet without using a conventional fastening method such as welding, clamping, or interlocking, a non-oriented electrical steel sheet stack to which the same is applied, and a manufacturing method thereof. According to an exemplary embodiment of the present invention, an adhesive coating composition includes: 40 to 99 wt % of a first component containing a water-soluble resin; and 1 to 60 wt % of a second component containing a composite metal phosphate.

The present invention has been made in an effort to provide an adhesive coating composition capable of adhering (fastening) a non-oriented electrical steel sheet without using a conventional fastening method such as welding, clamping, or interlocking, a non-oriented electrical steel sheet stack to which the same is applied, and a manufacturing method thereof. According to an exemplary embodiment of the present invention, an adhesive coating composition includes: 40 to 99 wt % of a first component containing a water-soluble resin; and 1 to 60 wt % of a second component containing a composite metal phosphate.

An adhesive composition including a first epoxy-based compound, a second epoxy-based compound, an oxetane compound, and a diacrylate-based compound is provided. A polarizing plate includes a polarizer, an adhesive layer provided on at least one surface of the polarizer and formed using the adhesive composition, and a protective film provided on at least one surface of the adhesive layer. An image display device using the polarizing plate is also provided.

An adhesive composition including a first epoxy-based compound, a second epoxy-based compound, an oxetane compound, and a diacrylate-based compound is provided. A polarizing plate includes a polarizer, an adhesive layer provided on at least one surface of the polarizer and formed using the adhesive composition, and a protective film provided on at least one surface of the adhesive layer. An image display device using the polarizing plate is also provided.

An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 50 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in an amount of 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in an amount of 2 parts by weight to 8 parts by weight, the aromatic epoxy compound is present in an amount of 7 parts by weight to 38 parts by weight, and the alicyclic epoxy compound is present in amount of 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 50 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in an amount of 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in an amount of 2 parts by weight to 8 parts by weight, the aromatic epoxy compound is present in an amount of 7 parts by weight to 38 parts by weight, and the alicyclic epoxy compound is present in amount of 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 50 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in an amount of 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in an amount of 2 parts by weight to 8 parts by weight, the aromatic epoxy compound is present in an amount of 7 parts by weight to 38 parts by weight, and the alicyclic epoxy compound is present in amount of 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

Provided is an alicyclic epoxy compound product used in applications for forming a cured product excellent in heat resistance and transparency. The alicyclic epoxy compound product according to an embodiment of the present invention includes 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, a purity of which is of not less than 98.5 wt. %, and each content of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is not greater than 0.5 wt. %. ##STR00001##

Provided is an alicyclic epoxy compound product used in applications for forming a cured product excellent in heat resistance and transparency. The alicyclic epoxy compound product according to an embodiment of the present invention includes 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, a purity of which is of not less than 98.5 wt. %, and each content of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is not greater than 0.5 wt. %. ##STR00001##

The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.