The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder component; and E) a photoinitiator component. The adhesive composition is useful for forming an adhesive. In various embodiments, the adhesive composition is in the form of a stick. The adhesive composition is useful for securing a fastener (e.g. in a borehole).

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

A pressure-sensitive structural adhesive film based on an epoxy resin composition, wherein the epoxy resin composition comprises a latent-reactive, thermally activatable curing agent for producing a structural bond after thermal curing and additionally a curing agent that cross-links at room temperature, wherein the not-cured adhesive film is compressible and therefore allows for tolerance compensation.

An adhesive composition containing an organic silicon compound represented by formula (1).

##STR00001##

[In the formula, R.sup.1 is an alkyl group or an aryl group, R.sup.2 are an alkyl group or an aryl group. R.sup.3 are an alkyl group, an aryl group, an aralkyl group, an alkenyl group, or an alkoxy group, but at least one is an alkoxy group. R.sup.4 is an alkyl group, an aryl group, an aralkyl group, or an organic group represented by formula (2), n is an integer of 1-3, m is an integer of 1-12.

##STR00002##

(In the formula, R.sup.5 is an alkyl group or an aryl group, R.sup.6 are an alkyl group or an aryl group, p is an integer of 0-12, q is an integer of 1-3. The broken line represents a bond.)]

An adhesive composition containing an organic silicon compound represented by formula (1).

##STR00001##

[In the formula, R.sup.1 is an alkyl group or an aryl group, R.sup.2 are an alkyl group or an aryl group. R.sup.3 are an alkyl group, an aryl group, an aralkyl group, an alkenyl group, or an alkoxy group, but at least one is an alkoxy group. R.sup.4 is an alkyl group, an aryl group, an aralkyl group, or an organic group represented by formula (2), n is an integer of 1-3, m is an integer of 1-12.

##STR00002##

(In the formula, R.sup.5 is an alkyl group or an aryl group, R.sup.6 are an alkyl group or an aryl group, p is an integer of 0-12, q is an integer of 1-3. The broken line represents a bond.)]