The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.

The invention relates to a fatty acid diamide-based rheology additive composition, which is pre-activated and pre-concentrated in fatty acid diamide, comprising: a) from 5% to 30% by weight of at least one fatty acid diamide based on 12 hydroxystearic acid and on a linear, in particular C5, C6 or C7, aliphatic diamine, b) from 70% to 95% by weight of at least one monofunctional (meth)acrylic reactive diluent comprising a cycloaliphatic group or several cycloaliphatic groups, the % being expressed relative to a)+b). It also relates to a process for preparing the composition and to the use thereof as a rheology additive in reactive binder compositions such as coating, moulding, composite material, anchor bolt or sealant compositions or photocrosslinkable compositions for stereolithography or for 3D printing of objects by inkjet.

The invention relates to a fatty acid diamide-based rheology additive composition, which is pre-activated and pre-concentrated in fatty acid diamide, comprising: a) from 5% to 30% by weight of at least one fatty acid diamide based on 12 hydroxystearic acid and on a linear, in particular C5, C6 or C7, aliphatic diamine, b) from 70% to 95% by weight of at least one monofunctional (meth)acrylic reactive diluent comprising a cycloaliphatic group or several cycloaliphatic groups, the % being expressed relative to a)+b). It also relates to a process for preparing the composition and to the use thereof as a rheology additive in reactive binder compositions such as coating, moulding, composite material, anchor bolt or sealant compositions or photocrosslinkable compositions for stereolithography or for 3D printing of objects by inkjet.

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

Structural adhesive films are presented which comprise branched or networked polymers which are the reaction product of one or more polyether sulfone polymers, which may include amine-terminated polyether sulfone polymers and/or hydroxy-terminated polyether sulfone polymers, with epoxy-functional chemical species including the reaction product of one or more first polyepoxides with an amine-terminated branched polytetrahydrofuran polymer. The structural adhesive films may possess high strength, holding power and durability in high-temperature applications.

Structural adhesive films are presented which comprise branched or networked polymers which are the reaction product of one or more polyether sulfone polymers, which may include amine-terminated polyether sulfone polymers and/or hydroxy-terminated polyether sulfone polymers, with epoxy-functional chemical species including the reaction product of one or more first polyepoxides with an amine-terminated branched polytetrahydrofuran polymer. The structural adhesive films may possess high strength, holding power and durability in high-temperature applications.

Structural adhesive films are presented which comprise branched or networked polymers which are the reaction product of one or more polyether sulfone polymers, which may include amine-terminated polyether sulfone polymers and/or hydroxy-terminated polyether sulfone polymers, with epoxy-functional chemical species including the reaction product of one or more first polyepoxides with an amine-terminated branched polytetrahydrofuran polymer. The structural adhesive films may possess high strength, holding power and durability in high-temperature applications.