C09J163/00

Epoxy resin composition

Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.

TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessing at least two epoxide reactive groups per molecule; and, b) an accelerator; wherein said composition further comprises an electrically non-conductive filler and, optionally a toughener.

Phenalkamine epoxy curing agents and epoxy resin compositions containing the same

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.

Phenalkamine epoxy curing agents and epoxy resin compositions containing the same

The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.

FILAMENT ARTICLE CONTAINING EPOXY-AMINE CURABLE COMPOSITION

A filament article containing a curable composition is provided. The filament article has a first part containing an epoxy resin and a second part containing a polyamine having at least two secondary or primary amino groups. The first part is surrounded by a sheath and a second part surrounded by a sheath. Either 1) the first part surrounded by the sheath and the second part surrounded by the sheath are each a separate filament or 2) the first part surrounded by the sheath and the second part surrounded by the sheath combine to form a composite filament. The curable filament article can be used to form a cured composition having structural bonding performance.

Curable Composition

Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Curable Composition

Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Bio-based Epoxy Coating Compositions and Methods of Preparation Thereof
20230073852 · 2023-03-09 · ·

The disclosure relates to epoxy-based compositions comprising a decarboxylated rosin acid (DCR) component, suitable as an efficient plasticizer. It further improves hardness, elasticity, UV exposure viability properties of the paint and coating compositions. The DCR increases the bio-based renewable material content of a coating formulation and provide solutions for phthalate-free products. The DCR has a density of 0.9 to 1.0 g/cm.sup.3, a flash point of 135 to 175° C., an acid value of < 50 mg KOH/g, measured according to ASTM D465, and a viscosity of 15 to 60 cSt at 40° C., measured according to ASTM D-445.