The present invention provides a UV curable composition, a UV curable adhesive film and a UV curable adhesive tape. The UV curable composition comprises, based on the total weight thereof as 100 wt %: 25 to 60 wt % of an ethylene-vinyl acetate copolymer; 20 to 60 wt % of an epoxy resin; 5 to 20 wt % of glass bubbles; 0.3 to 8 wt % of a hydroxy-containing compound; and 0.5 to 5 wt % of a photoinitiator. According to the technical solution of the present invention, cohesive failure can be achieved in the cured adhesive film by the addition of glass bubbles into the UV curable system. The UV curable product provided in the present invention can achieve a good balance among the initial adhesivity, structural strength after curing, odorlessness or low odor, and other performance.

Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epoxy resin miscibly blended with the multifunctional epoxy resin. The hardener part includes a polyetheramine. Either the base part or hardener part further comprises an inorganic filler present in an amount from 10 percent to 60 percent, relative to the overall weight of the two-part curable shimming adhesive, and a phosphoric acid ester. The shimming adhesive enables joints to be assembled in one step, providing a significant advantage to the user.

Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epoxy resin miscibly blended with the multifunctional epoxy resin. The hardener part includes a polyetheramine. Either the base part or hardener part further comprises an inorganic filler present in an amount from 10 percent to 60 percent, relative to the overall weight of the two-part curable shimming adhesive, and a phosphoric acid ester. The shimming adhesive enables joints to be assembled in one step, providing a significant advantage to the user.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.

A method for surface treatment of a silicone rubber includes: providing the silicone rubber bearing a polar group on a surface of the silicone rubber, and applying a multifunctional compound to the surface of the silicone rubber bearing the polar group to allow the multifunctional compound to react with the polar group to form a coating.

A method for surface treatment of a silicone rubber includes: providing the silicone rubber bearing a polar group on a surface of the silicone rubber, and applying a multifunctional compound to the surface of the silicone rubber bearing the polar group to allow the multifunctional compound to react with the polar group to form a coating.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of a crosslinker and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards.