A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

A vehicular camera includes a lens having a plurality of optical elements, a lens holder, and an imager printed circuit board. The lens is accommodated in a lens barrel. A cylindrical passageway of the lens holder accommodates at least a portion of the lens barrel. The imager printed circuit board has circuitry disposed thereat. The circuitry of the imager printed circuit board includes an imager that has an imaging array. A flexible electrical ribbon cable electrically connects the circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. The lens is held in optical alignment with the imaging array of the imager via an adhesive. The adhesive may bond the lens barrel to the lens holder at its front side. The imager printed circuit board may be attached at the lens holder at its rear side.

A vehicular camera includes a lens having a plurality of optical elements, a lens holder, and an imager printed circuit board. The lens is accommodated in a lens barrel. A cylindrical passageway of the lens holder accommodates at least a portion of the lens barrel. The imager printed circuit board has circuitry disposed thereat. The circuitry of the imager printed circuit board includes an imager that has an imaging array. A flexible electrical ribbon cable electrically connects the circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. The lens is held in optical alignment with the imaging array of the imager via an adhesive. The adhesive may bond the lens barrel to the lens holder at its front side. The imager printed circuit board may be attached at the lens holder at its rear side.

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.

A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.

There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

The present invention is directed to a curable and one component (1K) debondable adhesive composition comprising: a) epoxy resin; b) a curing agent for said epoxy resin; c) an electrolyte; and, d) an electrically non-conductive filler; wherein said composition comprises at least one of: e) a combination of a solubilizer and a toughener; and, f) electrically conductive particles.