Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a compatibilizer which has at least one silane group and at least one epoxy terminal group. The curable composition exhibits enhanced adhesion strength and good elongation at break. A method for applying the curable composition on the surface of a substrate is also provided.

This invention relates to an adhesive composition for a tire cord, a tire cord including an adhesive layer formed from the adhesive composition, and a tire including the tire cord. According to the present disclosure, an environment-friendly adhesive composition for a tire cord that can not only improve adhesive strength between tire rubber and a tire cord, but can also improve strength of a tire cord is provided.

This invention relates to an adhesive composition for a tire cord, a tire cord including an adhesive layer formed from the adhesive composition, and a tire including the tire cord. According to the present disclosure, an environment-friendly adhesive composition for a tire cord that can not only improve adhesive strength between tire rubber and a tire cord, but can also improve strength of a tire cord is provided.

A filter element comprises one or more several tubular filter media element segments, which may be pleated filter media ring segments. One or more heat activated disks are used to connect each tubular filter media element segments together and/or to connect tubular filter media element segments with one or more end cap supports. The heat activated disks are solid in form for assembly with tubular filter media ring segment and then heat activated to bond with tubular filter media ring segments. Multiple end caps can be simultaneously bonded to one or more tubular filter media element segments if a filter stack assembly of component are heated together, such as in an oven. Filter media may also be simultaneously cured. Heat activated disks may be used as pleat stabilizers and/or for and/or as part of end caps.

A filter element comprises one or more several tubular filter media element segments, which may be pleated filter media ring segments. One or more heat activated disks are used to connect each tubular filter media element segments together and/or to connect tubular filter media element segments with one or more end cap supports. The heat activated disks are solid in form for assembly with tubular filter media ring segment and then heat activated to bond with tubular filter media ring segments. Multiple end caps can be simultaneously bonded to one or more tubular filter media element segments if a filter stack assembly of component are heated together, such as in an oven. Filter media may also be simultaneously cured. Heat activated disks may be used as pleat stabilizers and/or for and/or as part of end caps.

A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

An adhesive film that can be wound and punched, comprising an epoxy-based adhesive compound that can be activated by UV-radiation or thermally and an expandable filler admixed to the adhesive compound to produce an adhesive film that is compressible when not yet cured.