The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol.

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol.

A borated benzoxazine compound, which can be used in particular as monomer in the synthesis of polybenzoxazine, corresponds to the formula:

##STR00001##

in which: Z represents an at least divalent, aliphatic, cycloaliphatic or aromatic, bonding group comprising at least one carbon atom and optionally at least one heteroatom chosen from O, S and P; and R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which are identical or different, represent hydrogen or an alkyl comprising from 1 to 12 carbon atoms, it being possible for R.sub.1 and R.sub.2, on the one hand, and R.sub.3 and R.sub.4, on the other hand, optionally to form a heterocycle with the two oxygen atoms and the boron atom to which they are respectively bonded.

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70 C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70 C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.

A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

##STR00001##

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

##STR00001##

A crosslinkable composition containing: a liquid monocyclic olefin ring-opened polymer (A) having a reactive group at a polymer chain end thereof and a weight-average molecular weight (Mw) of 1,000 to 50,000; and a crosslinkable compound (B) having, in the molecule, two or more functional groups reactive with the reactive group at the polymer chain end of the monocyclic olefin ring-opened polymer (A).