C09J165/00

Resin material and resin film
10086588 · 2018-10-02 · ·

A resin material including a hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in a weight ratio (hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer:hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer) of 100:0 to 1:99, the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer being obtained by melt-mixing a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer, a radical initiator, and a polar group-containing compound that includes an ethylenically unsaturated bond, the resin material including a structural unit derived from the polar group-containing compound that includes an ethylenically unsaturated bond in a ratio of 0.05 to 3.0 parts by weight based on 100 parts by weight of the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and the hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in total; and a resin film including the resin material; and a laminate film including the resin film.

Resin material and resin film
10086588 · 2018-10-02 · ·

A resin material including a hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in a weight ratio (hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer:hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer) of 100:0 to 1:99, the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer being obtained by melt-mixing a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer, a radical initiator, and a polar group-containing compound that includes an ethylenically unsaturated bond, the resin material including a structural unit derived from the polar group-containing compound that includes an ethylenically unsaturated bond in a ratio of 0.05 to 3.0 parts by weight based on 100 parts by weight of the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and the hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in total; and a resin film including the resin material; and a laminate film including the resin film.

Stack, method for treating substrate material, temporary fixing composition, and semiconductor device

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Stack, method for treating substrate material, temporary fixing composition, and semiconductor device

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Stack, method for treating substrate material, temporary fixing composition, and semiconductor device

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

Methods for sealing microcell containers with phenethylamine mixtures
10087344 · 2018-10-02 · ·

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

Methods for sealing microcell containers with phenethylamine mixtures
10087344 · 2018-10-02 · ·

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

Methods for sealing microcell containers with phenethylamine mixtures
10087344 · 2018-10-02 · ·

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer.

HOT MELT ADHESIVE COMPOSITION
20240301258 · 2024-09-12 ·

A hot melt adhesive composition comprises at least one styrene block copolymer, at least one acid modified rubber, and a tackifying resin comprising at least one acid tackifying resin. The hot melt adhesive composition can be used to bond substrates. The invention further relates to an article comprising the hot melt adhesive composition, to the use of a combination of an acid modified rubber and an acid tackifying resin for improving the aged wet adhesiveness of a hot melt adhesive composition, and to the use of a non-acid tackifying resin having a softening point of at least 110? C. for improving the initial adhesiveness of a hot melt adhesive composition comprising a combination of an acid modified rubber and an acid tackifying resin.

HOT MELT ADHESIVE COMPOSITION
20240301258 · 2024-09-12 ·

A hot melt adhesive composition comprises at least one styrene block copolymer, at least one acid modified rubber, and a tackifying resin comprising at least one acid tackifying resin. The hot melt adhesive composition can be used to bond substrates. The invention further relates to an article comprising the hot melt adhesive composition, to the use of a combination of an acid modified rubber and an acid tackifying resin for improving the aged wet adhesiveness of a hot melt adhesive composition, and to the use of a non-acid tackifying resin having a softening point of at least 110? C. for improving the initial adhesiveness of a hot melt adhesive composition comprising a combination of an acid modified rubber and an acid tackifying resin.