A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.

F.sup.1 is formula (IIa) and F.sup.2 is formula (IIb):

##STR00001## g and d are 0, 1, 2 or 3; R.sup.14 and R.sup.15 are C.sub.1-C.sub.4 or a cyclohexyl radical; R.sup.1 to R.sup.12 represents hydrogen or alkyl with 1 to 22 carbon atoms; x and y are integers, x+y is 0 to 2; R.sup.13 is oxygen or sulphur or divalent CH.sub.2 n1, n2, m, p1 and p2 are an integer or equal to 0 and such that the molecular weight Mn of the polymer of formula (I) is between 400 and 100 000 g/mol; a process for preparation of the polymer; and use as adhesive in mixture with an amino compound with at least two amine groups.

##STR00002##

Use of a synthetic resin system as an adhesive for chemical fixing technology, especially for fixing anchoring means in drilled holes, which synthetic resin system includes a) a reaction resin based on , -unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a catalyst, and to related subject matter.

Use of a synthetic resin system as an adhesive for chemical fixing technology, especially for fixing anchoring means in drilled holes, which synthetic resin system includes a) a reaction resin based on , -unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a catalyst, and to related subject matter.

The invention relates to a polymeric composite comprising poly(ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), waterborne polyurethane (WPU) and a sugar alcohol, wherein the sugar alcohol is selected from the group consisting of glycerol, erythritol, threitol, arabitol, xylitol, ribitol, mannitol, sorbitol, galactitol, fucitol, iditol, inositol, volemitol, isomalt, maltitol, lactitol, maltotriitol, maltotetraitol, polyglycitol, or a combination thereof, and wherein the sugar alcohol is 20 wt % to 50 wt % of the polymer composite; an electrical device comprising such composite. The present invention also relates to methods of fabricating and its uses thereof. In particular, the present invention relates to intrinsically conductive polymer composites suitable for use in efficient dry/wet epidermal biopotential monitoring. The polymer composites are advantageously self-adhesive and stretchable, and can be used as dry electrodes.

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure.

A method is provided for preparing a catecholamine-based compound by using plasma polymerization, and more specifically, to a method for artificially synthesizing various catecholamines, that is, monomolecular compounds capable of having a hydroxyl group (OH) as an ortho group of a benzene ring and various alkylamines as a para group thereof from a catecholamine precursor material such as phenol or aniline by using dry plasma polymerization.

A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.

A wafer laminate has an adhesive layer (3) sandwiched between a transparent substrate (1) and a water (2), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (3) includes a first cured resin layer (3a) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (3b) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.