C09J165/00

ADHESIVE COMPOSITION AND METHOD OF MAKING AND USING THE SAME

An adhesive composition and methods of making and using the same are disclosed. The composition includes a polymeric component and a metal cation or an oxidant. The polymeric component includes a silk fibroin protein and a catecholamine. The metal cation and/or the oxidant is present in an amount sufficient to initiate complexing and/or cross-linking of the adhesive composition.

ADHESIVE COMPOSITION AND METHOD OF MAKING AND USING THE SAME

An adhesive composition and methods of making and using the same are disclosed. The composition includes a polymeric component and a metal cation or an oxidant. The polymeric component includes a silk fibroin protein and a catecholamine. The metal cation and/or the oxidant is present in an amount sufficient to initiate complexing and/or cross-linking of the adhesive composition.

SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.

POLYARYLETHER KETONE IMIDE SULFONE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

##STR00001##

POLYARYLETHER KETONE IMIDE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

##STR00001##

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator.

Thermoplastic resin composition and laminate using the same
11339283 · 2022-05-24 · ·

There are provided a thermoplastic resin composition capable of bonding a cyclic polyolefin-based polymer and an ethylene-vinyl alcohol copolymer with sufficient strength and to provide a laminate using the same.

Thermoplastic resin composition and laminate using the same
11339283 · 2022-05-24 · ·

There are provided a thermoplastic resin composition capable of bonding a cyclic polyolefin-based polymer and an ethylene-vinyl alcohol copolymer with sufficient strength and to provide a laminate using the same.

Polybenzoxazine that can be used for coating metal and for the bonding of same to rubber

Polybenzoxazine comprises repeat units which comprise at least one unit corresponding to the formulae (I) or (II): ##STR00001##
in which Z.sub.1 and Z.sub.2, which are identical or different, represent an at least divalent, aliphatic, cycloaliphatic or aromatic bonding group comprising at least one carbon atom and optionally at least one heteroatom selected from O, S, N and P. Such a polybenzoxazine may be used as a metal-adhesive layer, in particular for the adhesive bonding of a metal substrate, in particular made of carbon steel, to a rubber.

Polybenzoxazine that can be used for coating metal and for the bonding of same to rubber

Polybenzoxazine comprises repeat units which comprise at least one unit corresponding to the formulae (I) or (II): ##STR00001##
in which Z.sub.1 and Z.sub.2, which are identical or different, represent an at least divalent, aliphatic, cycloaliphatic or aromatic bonding group comprising at least one carbon atom and optionally at least one heteroatom selected from O, S, N and P. Such a polybenzoxazine may be used as a metal-adhesive layer, in particular for the adhesive bonding of a metal substrate, in particular made of carbon steel, to a rubber.