C09J165/00

RADIATION-CURABLE COMPOSITION BY ANIONIC POLYMERIZATION
20220089804 · 2022-03-24 ·

The present invention refers to a radiation-curable composition comprising or consisting of A) at least one photo-base generator, which can generate a super base; B) (macro)monomers which are able to undergo an anionic polymerization via Michael addition comprising or consisting of B1) at least one (macro)monomer having at least one Michael donor group and at least one Michael acceptor group; and/or B2) at least one (macro)monomer having at least two Michael donor groups and at least one (macro)monomer having at least two Michael acceptor groups; C) optionally at least one polyethylenimine; D) optionally at least one additive.

Furthermore, the present invention pertains to an adhesive, sealant or coating obtainable by radiation-curing the radiation-curable composition according to the present invention and a method of radiation-curing the radiation-curable composition according to the present invention, comprising the steps: providing a radiation-curable composition according to the present invention and exposing the radiation-curable composition to radiation, for 10 seconds to 5 minutes. The radiation-curable compositions of the present invention do not require that irradiation is continuously applied until the curing is completed. Once the curing of the compositions is initiated, they are able to continue to cure in parts of the compositions which are in the dark/shadow.

RADIATION-CURABLE COMPOSITION BY ANIONIC POLYMERIZATION
20220089804 · 2022-03-24 ·

The present invention refers to a radiation-curable composition comprising or consisting of A) at least one photo-base generator, which can generate a super base; B) (macro)monomers which are able to undergo an anionic polymerization via Michael addition comprising or consisting of B1) at least one (macro)monomer having at least one Michael donor group and at least one Michael acceptor group; and/or B2) at least one (macro)monomer having at least two Michael donor groups and at least one (macro)monomer having at least two Michael acceptor groups; C) optionally at least one polyethylenimine; D) optionally at least one additive.

Furthermore, the present invention pertains to an adhesive, sealant or coating obtainable by radiation-curing the radiation-curable composition according to the present invention and a method of radiation-curing the radiation-curable composition according to the present invention, comprising the steps: providing a radiation-curable composition according to the present invention and exposing the radiation-curable composition to radiation, for 10 seconds to 5 minutes. The radiation-curable compositions of the present invention do not require that irradiation is continuously applied until the curing is completed. Once the curing of the compositions is initiated, they are able to continue to cure in parts of the compositions which are in the dark/shadow.

COMPOUND, METHOD FOR PRODUCING COMPOUND, ADHESIVE COMPOSITION AND ADHESIVE TAPE

The present invention aims to provide a compound capable of increasing the adhesion strength of adhesive compositions, particularly, even to low polarity adherends. The present invention also aims to provide a method for producing the compound, an adhesive composition containing the compound, and an adhesive tape including an adhesive layer containing the adhesive composition. Provided is a compound including: a structural unit (A) derived from a monomer (a) having a solvation free energy Δμ with polytetrafluoroethylene of −30 kcal/mol or less; and a structural unit (B) derived from at least one monomer (b) selected from the group consisting of a terpene monomer, a vinyl monomer, and a conjugated diene monomer.

COMPOUND, METHOD FOR PRODUCING COMPOUND, ADHESIVE COMPOSITION AND ADHESIVE TAPE

The present invention aims to provide a compound capable of increasing the adhesion strength of adhesive compositions, particularly, even to low polarity adherends. The present invention also aims to provide a method for producing the compound, an adhesive composition containing the compound, and an adhesive tape including an adhesive layer containing the adhesive composition. Provided is a compound including: a structural unit (A) derived from a monomer (a) having a solvation free energy Δμ with polytetrafluoroethylene of −30 kcal/mol or less; and a structural unit (B) derived from at least one monomer (b) selected from the group consisting of a terpene monomer, a vinyl monomer, and a conjugated diene monomer.

CO-EXTRUDED RUBBER-BASED MULTILAYER ADHESIVE ASSEMBLY

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.

CO-EXTRUDED RUBBER-BASED MULTILAYER ADHESIVE ASSEMBLY

The present disclosure relates to a co-extruded multilayer adhesive assembly comprising: a) a heat-activatable adhesive resin layer comprising a (co)polymer of one or more monomers selected from the group consisting of olefins; and b) a pressure sensitive adhesive polymeric foam layer comprising a rubber-based elastomeric material; wherein the heat-activatable adhesive resin layer is in direct contact with the pressure sensitive adhesive foam layer, and wherein the surface of the heat-activatable adhesive resin layer which is in direct contact with the pressure sensitive adhesive foam layer and the surface of the pressure sensitive adhesive foam layer which is indirect contact with the heat-activatable adhesive resin layer are free of any chemical or physical adhesion-promoting surface treatment. The present disclosure also relates to a method of manufacturing such a co-extruded multilayer adhesive assembly and uses thereof.

POLARIZING PLATE, POLARIZING PLATE ADHESIVE COMPOSITION FOR SAME, AND OPTICAL DISPLAY APPARATUS COMPRISING SAME
20210318478 · 2021-10-14 ·

Provided are a polarizing plate, a polarizing plate adhesive composition for same, and an optical display apparatus comprising same, the polarizing plate comprising: a polarizer; and a polarizing plate adhesive layer and a protective layer which are sequentially formed on at least one surface of the polarizer, wherein the polarizing plate adhesive layer comprises poly(ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS), and the polarizing plate adhesive layer has a surface resistance of about 1×10.sup.8 to about 1×10.sup.12(Ω/□).

POLARIZING PLATE, POLARIZING PLATE ADHESIVE COMPOSITION FOR SAME, AND OPTICAL DISPLAY APPARATUS COMPRISING SAME
20210318478 · 2021-10-14 ·

Provided are a polarizing plate, a polarizing plate adhesive composition for same, and an optical display apparatus comprising same, the polarizing plate comprising: a polarizer; and a polarizing plate adhesive layer and a protective layer which are sequentially formed on at least one surface of the polarizer, wherein the polarizing plate adhesive layer comprises poly(ethylenedioxythiophene) poly(styrenesulfonate) (PEDOT:PSS), and the polarizing plate adhesive layer has a surface resistance of about 1×10.sup.8 to about 1×10.sup.12(Ω/□).

Polyarylether ketone imide adhesives

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): ##STR00001##

Polyarylether ketone imide adhesives

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): ##STR00001##