The present invention relates to a peel detection label that is a laminate including a backing, a pattern layer formed in a part of the surface of the backing, and a pressure sensitive adhesive laminate having at least a pressure sensitive adhesive layer (X) and a substrate layer (Y) laminated in this order thereon, and satisfying the following requirement (1), wherein an elastic modulus of the substrate layer (Y) is 10 MPa or more and 800 MPa or less:

Requirement (1): On attaching the peel detection label onto an adherend and then peeling it from the adherend, interfacial peeling occurs between the backing and the pattern layer, whereby the presence or absence of peeling of the peel detection label from the adherend becomes visually detectable.

Disclosed herein are improved methods for bonding textiles using an adhesive composition.

Disclosed herein are improved methods for bonding textiles using an adhesive composition.

A fiber body forming method includes a step of applying, to a fiber body containing fibers, a liquid containing a thermoplastic resin which binds the fibers; and a step of heating the fiber body to which the liquid is applied, and in this method, the thermoplastic resin has a glass transition temperature of 10 C. or less, and the thermoplastic resin in the liquid has an average particle diameter of 30 nm or less.

A fiber body forming method includes a step of applying, to a fiber body containing fibers, a liquid containing a thermoplastic resin which binds the fibers; and a step of heating the fiber body to which the liquid is applied, and in this method, the thermoplastic resin has a glass transition temperature of 10 C. or less, and the thermoplastic resin in the liquid has an average particle diameter of 30 nm or less.

Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a -conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a -conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Disclosed is a plastic film adhesive agent, comprising 5095 percentage by weight of an organic polymer polyester resin; 0.130 percentage by weight of an isocyanate resin; 0.115 percentage by weight of an adhesion promoter; 1.030 percentage by weight of a first diluent; at most 15 percentage by weight of a second diluent; at most 5 percentage by weight of a catalyst; at most 5.5 percentage by weight of a modifier; and at most 10 percentage by weight of a stabilizer, which can directly adhere a polypropylene material to a metal surface.

Disclosed is a plastic film adhesive agent, comprising 5095 percentage by weight of an organic polymer polyester resin; 0.130 percentage by weight of an isocyanate resin; 0.115 percentage by weight of an adhesion promoter; 1.030 percentage by weight of a first diluent; at most 15 percentage by weight of a second diluent; at most 5 percentage by weight of a catalyst; at most 5.5 percentage by weight of a modifier; and at most 10 percentage by weight of a stabilizer, which can directly adhere a polypropylene material to a metal surface.

Disclosed is a plastic film adhesive agent, comprising 5095 percentage by weight of an organic polymer polyester resin; 0.130 percentage by weight of an isocyanate resin; 0.115 percentage by weight of an adhesion promoter; 1.030 percentage by weight of a first diluent; at most 15 percentage by weight of a second diluent; at most 5 percentage by weight of a catalyst; at most 5.5 percentage by weight of a modifier; and at most 10 percentage by weight of a stabilizer, which can directly adhere a polypropylene material to a metal surface.