An adhesive composition and a polarizing plate including an adhesive layer formed using the same are disclosed herein. In some embodiments, an adhesive composition includes 3-ethyl-3-(2-ethylhexyloxy)methyloxetane, 3-ethyl-3-hydroxymethyloxetane, 3,3′-oxybis(methylene)bis(3-ethyloxetane), an acryl-based compound, an aromatic epoxy compound, and an alicyclic epoxy compound, wherein the 3-ethyl-3-(2-ethylhexyloxy)methyloxetane is present in an amount of 20 parts by weight to 40 parts by weight, the 3-ethyl-3-hydroxymethyloxetane is present in 2 parts by weight to 8 parts by weight, the 3,3′-oxybis(methylene)bis(3-ethyloxetane) is present in 2 parts by weight to 8 parts by weight, the acryl-based compound is present in 5 parts by weight to 20 parts by weight, the aromatic epoxy compound is present in 7 parts by weight to 40 parts by weight, and the alicyclic epoxy compound is present in 10 parts by weight to 50 parts by weight, based on 100 parts by weight of the adhesive composition.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.

Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.