Patent classifications
C09J167/00
BISPHENOL-A-FREE COLD DRAW LAMINATING ADHESIVE
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.
BISPHENOL-A-FREE COLD DRAW LAMINATING ADHESIVE
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.
BISPHENOL-A-FREE COLD DRAW LAMINATING ADHESIVE
The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a high molecular weight polyester resin, an epoxy-terminated polyester, an additive, a curing agent, and a solvent, wherein, upon curing under curing conditions, the curable formulation forms at least one interpenetrating polymer network.
Hot melt adhesive
An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.
Hot melt adhesive
An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin.
Water-based adhesive compositions
Water-based adhesive composition are disclosed, the compositions comprising an acrylic dispersion, an epoxy-terminated polyester incorporated into the acrylic dispersion, and a water-dispersible isocyanate. Methods for laminating a first substrate to a second substrate are also disclosed, the methods comprising (a) providing an acrylic dispersion, (b) providing an epoxy-terminated polyester, (c) mixing the acrylic dispersion and the epoxy-terminated polyester, (d) mixing the mixture of (c) with a water-dispersible isocyanate to form an adhesive composition, (e) coating the adhesive composition of (d) on a surface of the first substrate, (f) drying the adhesive compositions on the first substrate to remove water, and (g) bringing the adhesive composition on the surface of the first substrate into contact with a surface of a second substrate, thereby laminating the first substrate to the second substrate. Laminates prepared comprising the water-based adhesives and according to the disclosed methods are also disclosed.
SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME
The embodiment of the present application relates to the field of Li-ion battery and, in particular, to a secondary battery. The secondary battery includes a cell, a safety component fixed on the cell and thermal conductive adhesive provided between the cell and the safety component, the thermal conductive adhesive contains at least one of hot melt adhesive, silica gel binder or epoxy resin binder, and thermal conductive filling material. The thermal conductive adhesive in the secondary battery performs good thermal conductivity and adhering property, which can stably adhere the safety component with the cell, meanwhile transferring, via the thermal conductive adhesive, heat of the cell to the safety component rapidly, so that the safety component cuts off the circuit to protect the cell during overcharge, thereby avoid situations that the thermal conductive adhesive is separated from the cell due to cell inflation and deformation.
PHOTORESPONSIVE POLYMER
An object of the present invention is to provide a photoresponsive polymer that sufficiently secures photoresponsiveness to be fluidized by light irradiation and reversibly non-fluidized, improves fixability, and further has good color reproducibility.
Provided is a photoresponsive polymer containing a structural unit derived from a specific azomethine derivative, the photoresponsive polymer being fluidized by light irradiation and reversibly non-fluidized.
PHOTORESPONSIVE POLYMER
An object of the present invention is to provide a photoresponsive polymer that sufficiently secures photoresponsiveness to be fluidized by light irradiation and reversibly non-fluidized, improves fixability, and further has good color reproducibility.
Provided is a photoresponsive polymer containing a structural unit derived from a specific azomethine derivative, the photoresponsive polymer being fluidized by light irradiation and reversibly non-fluidized.
CONDUCTIVE COMPOSITION AND ELECTRONIC PARTS USING THE SAME
A conductive composition, which can form bonded portions and is capable of maintaining a thickness of the bonded portions and bonding strength, and which includes: (A) silver fine particles having a number average particle diameter of primary particles of 40 nm to 400 nm, (B) a solvent, and (C) thermoplastic resin particles having a maximal value of an endothermic peak in a DSC chart, determined by a measurement using a differential scanning calorimeter, within a range of 80° C. to 170° C.