A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.

An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin:polyester elastomer) ranging from 20:80 to 80:20, wherein the area of portions where solid matter forms a phase separation structure attributed to both of the phenoxy resin and the polyester elastomer is at most 1 area % of an entire observation area in an elastic modulus phase image of a plurality of arbitrarily defined 10-μm square regions observed by an atomic force microscope (AFM) to which a probe having a tip radius of curvature of 10 nm at 25° C. is attached.

A polyester pressure-sensitive adhesive composition is provided including a polyester resin having a predetermined amount of a structural unit derived from a hydrogenated polybutadiene structure-containing compound, or a polyester resin having a structural unit derived from a hydrogenated polybutadiene structure-containing compound and a predetermined amount of a structural unit derived from an aromatic ring structure-containing compound. The polyester pressure-sensitive adhesive composition has superior adhesion to a polyolefin base material and is highly transparency.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

A moisture curable, non-bitumen based and non-asphaltic based adhesive includes an extender, a compatibilizer, and a polymer, wherein the polymer includes reactive silyl groups.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.

Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.