A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.

The invention relates to a multilayer structure (MS) comprising (SI) at least one first polymer layer (SI) comprising ?95% by weight, preferably ?98% by weight, particularly preferably ?99% by weight, based on the total weight of the polymer layer (SI), of a polymer (PI) selected from the group consisting of a polycarbonate, a co-polycarbonate or mixtures thereof having a Vicat softening temperature?149? C., preferably ?160? C., Further preferably ?170? C.; more preferably ?180? C., determined according to ISO 360:2004 (50N; 50? /h); (S2) at least one further polymer layer (S2) having a Vicat softening temperature<149? C., preferably ?140? C., more preferably ?130? C., determined according to ISO 306:2004 (50N; 50? /h), preferably in a range from 120? C. to 148? C.; (S3) optionally at least one third polymer layer (S3) having a Vicat softening temperature ?149? C., preferably ?160? C., further preferably ?170? C.; more preferably ?180? C., determined according to ISO 306:2004 (50N; 50? h). The invention further relates to a process for producing a multilayer structure (MS) and to a security document comprising such a multilayer structure according to the invention.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

The present invention refers to a formulation suitable for the manufacture of a pressure sensitive adhesive, said formulation comprising: a) 40-95 wt % of polyalkylene carbonate having a number average molecular weight higher than 17.000 Da; b) 5-60 wt % of a polyether carbonate polyol having CO.sub.2 groups randomly incorporated in the chemical structure thereof, wherein the content of CO.sub.2 ranges from 0.5 to 40 wt %, based on the total weight of the polyether carbonate polyol; and c) optionally, less than 30 wt % of a tackifying resin, provided that said formulation does not contain any reticulating agent.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.