The present application is directed to a method for preparing a cyclic carbonate functional polyester, said method comprising the stages of (A) reacting glycerine carbonate with an anhydride to form an Adduct (A), (B) reacting said Adduct (A) with at least one polyepoxide compound to form an Adduct (B), and (C) reacting said Adduct (B) with at least one polycarboxylic acid to form said cyclic carbonate functional polyester.

Disclosed is a polyalkylene carbonate and polyolefin-based composite and, more particularly, a composite prepared through reaction of a mixed composition including polyalkylene carbonate, polyolefin, an initiator, and a blending aid, wherein an amount of the polyalkylene carbonate is 60 wt % to 95 wt %, a total amount of the initiator, the blending aid, and the polyolefin is 5 wt % to 40 wt %, and the composite has a matrix-filler morphology in which a matrix formed of the polyalkylene carbonate includes a filler formed of the polyolefin.

Disclosed is a polyalkylene carbonate and polyolefin-based composite and, more particularly, a composite prepared through reaction of a mixed composition including polyalkylene carbonate, polyolefin, an initiator, and a blending aid, wherein an amount of the polyalkylene carbonate is 60 wt % to 95 wt %, a total amount of the initiator, the blending aid, and the polyolefin is 5 wt % to 40 wt %, and the composite has a matrix-filler morphology in which a matrix formed of the polyalkylene carbonate includes a filler formed of the polyolefin.

The present invention is directed to a polymer blend comprising at least one polyalkylencarbonate (PAC) and at least one polyhydroxyalkanoate (PHA) with low crystallinity. The invention also describes processes to prepare the blends of the invention and articles made of said blends.

The present invention is directed to a polymer blend comprising at least one polyalkylencarbonate (PAC) and at least one polyhydroxyalkanoate (PHA) with low crystallinity. The invention also describes processes to prepare the blends of the invention and articles made of said blends.

The disclosure relates to articles comprising a substrate, a pressure sensitive adhesive, and a release layer, wherein the release layer comprises at least one silicone carbonate polymer.

Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

The present invention relates to a process for preparing mercapto-crosslinked polyethercarbonate and sees polyethercarbonate polyols containing double bonds being reacted with polyfunctional mercaptans and/or sulfur with the involvement of initiator compounds.