The invention provides polymer compositions, compounds, processes, and methods of use of the polymers for biodegradable consumer plastics, adhesives, e.g., bioadhesives, pressure sensitive adhesives and thermos-responsive adhesives.

Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70 C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70 C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70 C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70 C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape.

A moisture-curable silylated resin is derived from a copolycarbonate diol prepared from diol(s) of specific types.

A moisture-curable silylated resin is derived from a copolycarbonate diol prepared from diol(s) of specific types.

A moisture-curable silylated resin is derived from a copolycarbonate diol prepared from diol(s) of specific types.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

Embodiments of the present disclosure provide for transient adhesive polymers, methods of making transient adhesive polymers, structures including the transient adhesive polymer attaching two portions of the structure to one another, and the like.

A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.